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	Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer 期刊论文 JOURNAL OF POLYMER RESEARCH, 2022, 卷号: 29 作者: Zhang, Ping; Zhang, Xian; Ding, Xin; Wang, Yanyan; Xiao, Chao 收藏 \| 浏览/下载：14/0 \| 提交时间：2022/12/23 Segregated structure Intermetallic compound Thermal conductivity Sliver interface layer
	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：15/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP
	Research on Bi contents addition into Sn-Cu-based lead-free solder alloy 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 19, 页码: 15586-15603 作者: Huang, Hai; Chen, Bin; Hu, Xiaowu; Jiang, Xiongxin; Li, Qinglin 收藏 \| 浏览/下载：85/0 \| 提交时间：2022/07/19 Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
	Enhanced mechanical properties and corrosion behavior of Zn-30Sn-2Cu high-temperature lead-free solder alloy by adding Sm 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2022, 卷号: 33, 期号: 9, 页码: 6469-6484 作者: Zhang, Huajin; Hu, Xiaowu; Liu, Yi; Zhang, Jiankang; Jiang, Xiongxin 收藏 \| 浏览/下载：27/0 \| 提交时间：2022/03/01 Corrosion resistance Corrosion resistant alloys Corrosive effects Ductile fracture Electrochemical impedance spectroscopy Galvanic corrosion High temperature corrosion Lead-free solders Morphology Tensile strength Zinc Zinc alloys Corrosion behaviour Electrochemical-impedance spectroscopies Fracture morphology Highest temperature Lead-free solder alloy Polarization impedance Potentiodynamics polarization Rich phase Sm addition Ultimate tensile strength
	A perspective on effect by Ag addition to corrosion evolution of Pb-free Sn solder 期刊论文 MATERIALS LETTERS, 2021, 卷号: 297, 页码: 4 作者: Qiao, Chuang; Sun, Xu; Wang, Youzhi; Hao, Long; An, Xizhong 收藏 \| 浏览/下载：57/0 \| 提交时间：2021/10/15 Lead-free solder Thin films Oxidation Corrosion X-ray photoelectron spectroscopy (XPS)
	Effect of Bi addition on the shear strength and failure mechanism of low-Ag lead-free solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2021, 页码: 15 作者: Chen, Yinbo; Meng, Zhi-Chao; Gao, Li-Yin; Liu, Zhi-Quan 收藏 \| 浏览/下载：12/0 \| 提交时间：2021/03/15
	Interfacial Structure and Mechanical Properties of Lead-Free Bi-Containing Solder/Cu Microelectronic Interconnects 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2021, 卷号: 50, 期号: 1, 页码: 258-262 作者: Liu, C. Z.; Wang, J. J.; Zhu, M. W.; Liu, X. M.; Lu, T. N. 收藏 \| 浏览/下载：25/0 \| 提交时间：2021/02/03
	Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder 期刊论文 Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302 作者: Yu, Weiyuan; Sun, Jungang; Liu, Yun; B., Wu; Z., Lei 收藏 \| 浏览/下载：8/0 \| 提交时间：2022/02/17 Binary alloys Brazing Brazing filler metals Grain size and shape Intermetallics Melting point Microstructure Nanoparticles Synthesis (chemical) Brazing joints Composite solders Crystal planes Driving forces Interfacial intermetallics Liquidus temperature Melting process Melting properties
	Shear strength and fracture surface analysis of lead-free solder joints with high fraction of IMCs 期刊论文 Vacuum, 2020, 卷号: 180 作者: Qiu, Hongyu; Hu, Xiaowu; Li, Shuang; Wan, Yongqiang; Li, Qinglin 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Binary alloys Copper alloys Elastic moduli Fracture Fracture mechanics Shear flow Soldered joints Surface analysis Tin alloys Area ratios Fracture mechanisms Fracture surface analysis Fracture surfaces Fractured surfaces Isothermal aging Lead-free solder joint Solder joints
	Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337 作者: Ye, Chang-Sheng; Ci, Wen-Juan; Lin, Qiao-Li; Sui, Ran; Wang, Jian-Bin 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Binary alloys Cobalt alloys Copper alloys Descaling Free energy Lead-free solders Oxide films Silicon Silicon compounds Silver alloys Surface reactions Ternary alloys Tin Wetting Co-based alloys Crystalline state Sn-based solders Surface free energy Surface oxide films Temperature range Wetting balance methods Wetting mechanism

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