Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder

	Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder
	Yu, Weiyuan; Sun, Jungang; Liu, Yun; B., Wu; Z., Lei
刊名	Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering
	2020-12-01
卷号	49 期号:12 页码:4297-4302
关键词	Binary alloys Brazing Brazing filler metals Grain size and shape Intermetallics Melting point Microstructure Nanoparticles Synthesis (chemical) Brazing joints Composite solders Crystal planes Driving forces Interfacial intermetallics Liquidus temperature Melting process Melting properties
ISSN号	1002185X
英文摘要	A lead-free composite solder was synthesized by adding SnO2 nanoparticles into Sn0.6Cu solder by a ultrasonic-assisted method. The effects of the SnO2 nanoparticles on the microstructure, melting property, and the interfacial reaction products of Cu/Sn0.6Cu-xSnO2/Cu brazing joints were investigated. The thickness and grain size of intermetallic compound (IMC) layer were measured. The results show that 1.0% (mass fraction) SnO2 inhibits the growth of β-Sn in the brazing filler metal and refines the grain size. The melting point of the SnO2-containing solder is substantially the same as that of the SnO2-free solder, but the melting range is significantly reduced. In addition, the application of ultrasound during the solders melting process can refine the grains, and the melting point and liquidus temperature of the obtained solder are also lower than those of the conventionally melted solder. The IMC layer at the interface of the solder joint with SnO2 solder is thinner and the grain size is smaller. The main reason is that SnO2 nanoparticles are adsorbed to the crystal plane of the interfacial intermetallic compound, which hinders the interdiffusion between the copper plate and the solder matrix; thus it results in a lower driving force for the formation of IMC, and inhibits the growth of interface compound. © 2020, Science Press. All right reserved.
WOS研究方向	Materials Science ; Metallurgy & Metallurgical Engineering
语种	中文
出版者	Science Press
WOS记录号	WOS:000607448600038
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/150785]
专题	实验室建设与管理处
作者单位	State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metals, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Yu, Weiyuan,Sun, Jungang,Liu, Yun,et al. Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder[J]. Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,2020,49(12):4297-4302.
APA	Yu, Weiyuan,Sun, Jungang,Liu, Yun,B., Wu,&Z., Lei.(2020).Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder.Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering,49(12),4297-4302.
MLA	Yu, Weiyuan,et al."Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder".Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering 49.12(2020):4297-4302.