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浏览/检索结果: 共14条，第1-10条 帮助 限定条件 发表日期：2019     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Reliability issues of lead-free solder joints in electronic devices 期刊论文 SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901 作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min 收藏  |  浏览/下载：77/0  |  提交时间：2021/02/02 Lead-free solder  reliability  IMC  crack  failure   Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文 SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444 作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei 收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02 Sn-Cu  microstructures  IMC  mechanical properties   Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua 收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14 Atomic force microscopy  Coatings  Copper compounds  Electroplating  Gold  Growth rate  Lead-free solders  Metallic films  Scanning electron microscopy  Semiconductor doping  Silver alloys  Silver metallography  Soldering  Substrates  Surface roughness  Ternary alloys  Thermal aging  Tin alloys  Tin compounds  Tin metallography  X ray photoelectron spectroscopy  Benzotriazole(BTA)  Electroplated Cu films  Heterocyclic compound  Interfacial microstructure evolution  Isothermal aging  Kovar substrates  Low concentrations  Soldering process   Formation and Evolution of Cu-Sn Intermetallic Compounds in Ultrasonic-Assisted Soldering 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 9, 页码: 5595-5602 作者:  Yu, Weiyuan;  Liu, Yingzong;  Liu, Yun 收藏  |  浏览/下载：5/0  |  提交时间：2022/02/17 Binary alloys  Copper compounds  Interface states  Intermetallics  Lead-free solders  Microstructure  Phase interfaces  Soldering  Tin compounds  Ultrasonic effects  Unmanned aerial vehicles (UAV)  Formation and evolutions  Growth patterns  IMC layer  Interfacial intermetallics  Liquid interface  Nonequilibrium state  Ultrasonic vibration   Insights on interfacial IMCs growth and mechanical strength of asymmetrical Cu/SAC305/Cu-Co system 期刊论文 VACUUM, 2019, 卷号: 167, 页码: 77-89 作者:  Hu, Xiaowu;  Li, Chao;  Li, Qinglin;  Yi, Guangbin 收藏  |  浏览/下载：5/0  |  提交时间：2019/11/15 SAC305 lead-free solders  Interfacial reaction  Intermetallic compound  Shear strength  Fracture   Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063 作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei 收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02 Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063 作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei 收藏  |  浏览/下载：23/0  |  提交时间：2021/02/02 Effects of aluminum addition (x=0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文 MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 8 作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin 收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15 Zn-Sn alloys  mechanical properties  fracture analysis  microstructure refinement   Effect of Cu concentration on the interfacial reactions between Sn-xCu solders and Cu substrate 期刊论文 MATERIALS RESEARCH EXPRESS, 2019, 卷号: 6, 期号: 7 作者:  Bao, Nifa;  Hu, Xiaowu;  Li, Qinglin;  Li, Shuang 收藏  |  浏览/下载：10/0  |  提交时间：2019/11/15 lead-free solder  Sn-Cu solder alloy  intermetallics  microstructure   Effects of aluminum addition (x = 0-1 wt%) on the thermal behavior, microstructure and mechanical properties of Zn-30Sn high temperature lead-free solder alloy 期刊论文 Materials Research Express, 2019, 卷号: 6, 期号: 8 作者:  Li, Jiayin;  Hu, Xiaowu;  Zhang, Xudong;  Li, Qinglin 收藏  |  浏览/下载：0/0  |  提交时间：2020/11/14 Aluminum  Binary alloys  Ductile fracture  Eutectics  Fracture mechanics  Lead-free solders  Mechanical properties  Microstructure  Tensile strength  Ternary alloys  Tin alloys  Eutectic structures  Fracture analysis  Lead-free solder alloy  Microstructure and mechanical properties  Microstructure refinement  Peritectic reaction  Ultimate tensile strength  Zn-Sn alloys