Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles

doi:10.1007/s10854-019-01878-w

CORC > 金属研究所 > 中国科学院金属研究所

	Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles
	Zhao, Meng 2; Zhang, Liang 2; Liu, Zhi-quan 3; Xiong, Ming-yue 2; Sun, Lei 1; Jiang, Nan 2; Xu, Kai-kai 2
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2019-08-01
卷号	30 期号:16 页码:15054-15063
ISSN号	0957-4522
DOI	10.1007/s10854-019-01878-w
通讯作者	Zhang, Liang(zhangliang@jsnu.edu.cn)
英文摘要	With the purpose of improving the properties of the Sn-3.8Ag-0.7Cu lead-free solder 0.5 wt% micro-CuZnAl particles were added. The experimental results showed that CuZnAl particles had little effect on the melting characteristics of Sn-3.8Ag-0.7Cu alloy. With the addition of CuZnAl particles, the tensile and shear stresses of solder joints were increased by 21% and 19%, respectively, and the microstructure matrix was refined obviously. However, the spreading area of solder was reduced by 7.2% and 3.6% at 230 degrees C and 250 degrees C on Cu substrates, respectively. In addition, the effect of CuZnAl particles on the growth of interfacial IMCs in the structure of Cu/Sn-3.8Ag-0.7Cu/Cu solder joints was studied. The results showed that the addition of 0.5 wt% CuZnAl particles could inhibit the growth of IMCs layer and the formation of voids.
资助项目	National Key R&D Program of China[2017YFB0305700] ; Natural Science Foundation of China[51475220] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ-19Z04] ; Six talent peaks project in Jiangsu Province[XCL-022] ; Qing Lan Project ; China Postdoctoral Science Foundation[2016M591464] ; International Cooperation Project[2015DFA50470]
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	SPRINGER
WOS记录号	WOS:000480558400025
资助机构	National Key R&D Program of China ; Natural Science Foundation of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Six talent peaks project in Jiangsu Province ; Qing Lan Project ; China Postdoctoral Science Foundation ; International Cooperation Project
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/134862]
专题	金属研究所_中国科学院金属研究所
通讯作者	Zhang, Liang
作者单位	1.Nanjing Univ Aeronaut & Astronaut, Coll Mech & Elect Engn, Nanjing 210016, Jiangsu, Peoples R China 2.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China 3.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Liaoning, Peoples R China
推荐引用方式 GB/T 7714	Zhao, Meng,Zhang, Liang,Liu, Zhi-quan,et al. Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2019,30(16):15054-15063.
APA	Zhao, Meng.,Zhang, Liang.,Liu, Zhi-quan.,Xiong, Ming-yue.,Sun, Lei.,...&Xu, Kai-kai.(2019).Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,30(16),15054-15063.
MLA	Zhao, Meng,et al."Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 30.16(2019):15054-15063.