Reliability issues of lead-free solder joints in electronic devices

doi:10.1080/14686996.2019.1640072

CORC > 金属研究所 > 中国科学院金属研究所

	Reliability issues of lead-free solder joints in electronic devices
	Jiang, Nan 1; Zhang, Liang 1,5; Liu, Zhi-Quan 2; Sun, Lei 4; Long, Wei-Min 3; He, Peng 5; Xiong, Ming-Yue 1; Zhao, Meng 1
刊名	SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS
	2019-12-31
卷号	20 期号:1 页码:876-901
关键词	Lead-free solder reliability IMC crack failure
ISSN号	1468-6996
DOI	10.1080/14686996.2019.1640072
通讯作者	Zhang, Liang(zhangliang@jsnu.edu.cn)
英文摘要	Electronic products are evolving towards miniaturization, high integration, and multi-function, which undoubtedly puts forward higher requirements for the reliability of solder joints in electronic packaging. Approximately 70% of failure in electronic devices originates during the packaging process, mostly due to the failure of solder joints. With the improvement of environmental protection awareness, lead-free solder joints have become a hot issue in recent years. This paper reviews the research progress on the reliability of lead-free solder joints and discusses the influence of temperature, vibration, tin whisker and electromigration on the reliability of solder joints. In addition, the measures to improve the reliability of solder joints are analyzed according to the problems of solder joints themselves, which provides a further theoretical basis for the study of the reliability of solder joints of electronic products in service.
资助项目	National Key R&D Program of China[2017YFB0305700] ; Key project of State Key Laboratory of Advanced Welding and Joining[AWJ-19Z04] ; Qing Lan Project ; Six talent peaks project in Jiangsu Province[XCL-022] ; Natural Science Foundation of China[51475220] ; [2015DFA50470]
WOS研究方向	Materials Science
语种	英语
出版者	TAYLOR & FRANCIS LTD
WOS记录号	WOS:000483617100001
资助机构	National Key R&D Program of China ; Key project of State Key Laboratory of Advanced Welding and Joining ; Qing Lan Project ; Six talent peaks project in Jiangsu Province ; Natural Science Foundation of China
内容类型	期刊论文
源URL	[http://ir.imr.ac.cn/handle/321006/135405]
专题	金属研究所_中国科学院金属研究所
通讯作者	Zhang, Liang
作者单位	1.Jiangsu Normal Univ, Sch Mechatron Engn, Xuzhou 221116, Jiangsu, Peoples R China 2.Chinese Acad Sci, Inst Met Res, Shenyang, Liaoning, Peoples R China 3.Zhengzhou Res Inst Mech Engn, State Key Lab Adv Brazing Filler Met & Technol, Zhengzhou, Henan, Peoples R China 4.Nanjing Univ Aeronaut & Astronaut, Natl Key Lab Sci & Technol Helicopter Transmiss, Nanjing, Jiangsu, Peoples R China 5.Harbin Inst Technol, State Key Lab Adv Welding & Joining, Harbin, Heilongjiang, Peoples R China
推荐引用方式 GB/T 7714	Jiang, Nan,Zhang, Liang,Liu, Zhi-Quan,et al. Reliability issues of lead-free solder joints in electronic devices[J]. SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,2019,20(1):876-901.
APA	Jiang, Nan.,Zhang, Liang.,Liu, Zhi-Quan.,Sun, Lei.,Long, Wei-Min.,...&Zhao, Meng.(2019).Reliability issues of lead-free solder joints in electronic devices.SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS,20(1),876-901.
MLA	Jiang, Nan,et al."Reliability issues of lead-free solder joints in electronic devices".SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS 20.1(2019):876-901.