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CORC

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Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330
作者:  Zhang, Xudong;  Hu, Xiaowu;  Jiang, Xiongxin;  Zhou, Liuru;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2020/06/16
Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文
Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137
作者:  Yi, Xiong;  Yi, Guangbin;  Hu, Xiaowu;  Li, Qinglin;  Zhang, Ruhua
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Shear strength and fracture behavior of solder/Kovar joints with electroplated Cu film 期刊论文
VACUUM, 2019, 卷号: 167, 页码: 428-437
作者:  Hu, Xiaowu;  Bao, Nifa;  Li, Qinglin
收藏  |  浏览/下载：11/0  |  提交时间：2019/11/15
The stripping analysis of Hg(II) and Cu(II) based on hierarchical RTIL/gamma-AlOOH/Fe(OH)(3) composite 期刊论文
ELECTROCHIMICA ACTA, 2018, 卷号: 287, 页码: 87-95
作者:  Zhang, Yongxing;  Wang, Qi;  Xie, Fazhi;  Xiong, Shiquan
收藏  |  浏览/下载：27/0  |  提交时间：2019/12/20
Fabrication of an ultra-thin low resistance and high stability Ru-Mo-C seedless barrier for advanced Cu dual-damascene interconnects 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2018
作者:  Lin, Liwei;  Jiao, Guohua;  Lu, Yuanfu;  Liu, Bo;  Zou, Jianxiong
收藏  |  浏览/下载：65/0  |  提交时间：2019/01/31
The role of sulfurization temperature on the morphological, structural and optical properties of electroplated Cu2MnSnS4 absorbers for photovoltaics 期刊论文
MATERIALS LETTERS, 2018, 卷号: 233, 页码: 111-114
作者:  Yu, Jiejin[1];  Deng, Hongmei[2];  Zhang, Qiao[3];  Tao, Jiahua[4];  Sun, Lin[5]
收藏  |  浏览/下载：8/0  |  提交时间：2019/04/22
Explore of warpage origination in wlp and processing influence factors by experiment and theoretical modeling 期刊论文
Journal of materials science-materials in electronics, 2016, 卷号: 27, 期号: 11, 页码: 11548-11555
作者:  Li, Heng;  Cheng, Gong;  Xu, Gaowei;  Luo, Le
收藏  |  浏览/下载：16/0  |  提交时间：2019/05/09
Influence of polyimide on thermal stress evolution in polyimide/cu thick film composite 期刊论文
Journal of materials science-materials in electronics, 2016, 卷号: 27, 期号: 8, 页码: 8325-8331
作者:  Li, Heng;  Cheng, Gong;  Xu, Gaowei;  Luo, Le
收藏  |  浏览/下载：21/0  |  提交时间：2019/05/09
Experimental identification of thermal induced warpage in polymer-metal composite films 期刊论文
Microelectronics reliability, 2016, 卷号: 62, 页码: 141-147
作者:  Li, Heng;  Zhu, Chunsheng;  Xu, Gaowei;  Luo, Le
收藏  |  浏览/下载：59/0  |  提交时间：2019/05/09
Fabrication and Thermo-Mechanical Characterization of Fine Pitch All-Copper Interconnect 期刊论文
journal of the electrochemical society, 2012
Saha, Rajarshi; Koo, Hyo-Chol; An, Ping Nicole; Kohl, Paul A.
收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16

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