Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer

doi:10.1007/s10965-022-03242-9

	Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer
	Zhang, Ping 2,3; Zhang, Xian 1,3; Ding, Xin 3; Wang, Yanyan 2,3; Xiao, Chao 1,3; Zheng, Kang 1,3; Chen, Lin 3; Tian, Xingyou 3
刊名	JOURNAL OF POLYMER RESEARCH
	2022-09-01
卷号	29
关键词	Segregated structure Intermetallic compound Thermal conductivity Sliver interface layer
ISSN号	1022-9760
DOI	10.1007/s10965-022-03242-9
通讯作者	Zhang, Xian(xzhang@issp.ac.cn) ; Tian, Xingyou(xytian@issp.ac.cn)
英文摘要	Low-melting-point alloy (LMPA) is regarded as one of the most promising fillers for improving heat dissipation performance of polymer-matrix composites. Nevertheless, the promise of excellent functional composites with low content of LMPA has been greatly weakened as poor compatibility between LMPA and polymer. To address this problem, introducing metal interface layer to polymer microsphere' surface is promising method by inspiration of depositing silver coating on copper-clad laminates. Here, silver interface layer was introduced to the surface of polyvinylidene fluoride microspheres through the polydopamine (PVDF@PDA@Ag). After mixing PVDF@PDA@Ag microspheres with Sn-58Bi (LMPA), PVDF@PDA@Ag/LMPA composite with segregated structure was successfully fabricated by hot-pressing. X-ray diffraction (XRD) test revealed that intermetallic compounds of Ag3Sn was production. Owing to Ag3Sn promoting LMPA coated on surface of microsphere, the microscopic conduction path of composites transforming from irregular continuous LMPA network to segregated network. In the case of low LMPA content (10 vol%), PVDF@PDA@Ag/LMPA composite owned thermal conductivity of 1.79 W/mK, while PVDF/LMPA composite was only 0.36 W/mK. Compared to PVDF/LMPA composite, the enhancement factor of PVDF@PDA@Ag/LMPA composite was improved from 56.52% to 678.26%. This article offered viable route to enhance compatibility between polymer and LMPA.
资助项目	National Natural Science Foundation of China[U21A2094] ; CASHIPS Director's Fund[YZJJZX202015]
WOS关键词	LEAD-FREE SOLDER ; BORON-NITRIDE ; COMPOSITES ; LIQUID ; NANOCOMPOSITES ; NANOPARTICLES ; NETWORK ; JOINTS ; CONSTRUCTION ; DESIGN
WOS研究方向	Polymer Science
语种	英语
出版者	SPRINGER
WOS记录号	WOS:000841798100001
资助机构	National Natural Science Foundation of China ; CASHIPS Director's Fund
内容类型	期刊论文
源URL	[http://ir.hfcas.ac.cn:8080/handle/334002/132061]
专题	中国科学院合肥物质科学研究院
通讯作者	Zhang, Xian; Tian, Xingyou
作者单位	1.Anhui Inst Innovat Ind Technol, Luan Branch, Luan, Peoples R China 2.Univ Sci & Technol China, Hefei 230026, Peoples R China 3.Chinese Acad Sci, Inst Solid State Phys, Key Lab Photovolta & Energy Conservat Mat, HFIPS, Hefei 230031, Peoples R China
推荐引用方式 GB/T 7714	Zhang, Ping,Zhang, Xian,Ding, Xin,et al. Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer[J]. JOURNAL OF POLYMER RESEARCH,2022,29.
APA	Zhang, Ping.,Zhang, Xian.,Ding, Xin.,Wang, Yanyan.,Xiao, Chao.,...&Tian, Xingyou.(2022).Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer.JOURNAL OF POLYMER RESEARCH,29.
MLA	Zhang, Ping,et al."Improving thermal conductivity of polyvinylidene fluoride/low-melting-point alloy with segregated structure induced by incorporation of silver interface layer".JOURNAL OF POLYMER RESEARCH 29(2022).