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浏览/检索结果: 共36条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录) 期刊论文 Journal of Alloys and Compounds, 2017, 卷号: 719, 页码: 365-375 作者:  Tang, Y.[1];  Luo, S.M.[1];  Huang, W.F.[1];  Pan, Y.C.[2];  Li, G.Y.[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/24 Brittle fracture  Copper alloys  Ductile fracture  Fracture  Intermetallics  Lead  free solders  Manganese  Nanoparticles  Scanning electron microscopy  Silver  Silver alloys  Soldered joints  Soldering alloys  Strain rate  Tensile properties  Tensile testing  Tin  Tin alloys   Effect of Nano-TiO2particles on growth of interfacial Cu6Sn5and Cu3Sn layers in Sn-3.0Ag-0.5Cu-xTiO2solder joints (EI收录SCI收录) 期刊论文 Journal of Alloys and Compounds, 2016, 卷号: 684, 页码: 299-309 作者:  Tang, Y.[1];  Luo, S.M.[1];  Wang, K.Q.[1];  Li, G.Y.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Activation energy  Chemical activation  Copper compounds  Diffusion  Energy dispersive spectroscopy  Grain boundaries  Grain growth  Intermetallics  Lead  free solders  Scanning electron microscopy  Silver  Soldered joints  Soldering alloys  Titanium dioxide  X ray diffraction  X ray spectroscopy   Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录) 会议论文 11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005 作者:  Zhang, X.P.[1,2];  Shi, Y.W.[3];  Mai, Y.W.[1];  Shrestha, S.[4];  Dorn, L.[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 Creep  Creep resistance  Fractography  Fracture  Fracture mechanics  Lead  Microelectronics  Nanocomposites  Particle reinforced composites  Silver  Silver alloys  Soldering alloys  Textures   Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection (EI收录) 会议论文 Journal of Materials Processing Technology, Singapore, Singapore, December 4, 2006 - December 6, 2006 作者:  Zhang, X.P.[1];  Yu, C.B.[1];  Zhang, Y.P.[1];  Shrestha, S.[2];  Dorn, L.[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/17 Creep  Laser beams  Lead  Silver  Soldering alloys  Tin alloys   Effect of dopant on microstructure and mechanical properties of Pb-free solder joints (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Shanghai, China, August 14, 2007 - August 17, 2007 作者:  Li, G.Y.[1] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/17 Activation energy  Alloys  Brazing  Copper  Copper alloys  Electronics packaging  Lead  Mechanical properties  Semiconducting intermetallics  Silver  Silver alloys  Soldering alloys  Technology  Tin alloys  Welding   Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Ultrasonic-assisted Soldering of Sn-based Solder Alloys to Form Intermetallic Interconnects for High Temperature Application (CPCI-S收录) 会议 作者:  Ji, Hongjun[1];  Li, Mingyu[1];  Qiao, Yunfei[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 ultraosnic-assisted soldering  Sn-based lead-free solder  automotive sensors  high power packaging  processes  interconnetion   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Interfacial reaction and IMC growth between the undercooled liquid lead-free solder and Cu metallization (CPCI-S收录) 会议 作者:  Zhou, Min-Bo[1,2];  Feng, Jian-Qiang[1,2];  Yue, Wu[3];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 interfacial reaction  intermetallic compound  undercooling dwelling  low temperature soldering   Protection against lead-free solder in wave-soldering by Ti/TiC coatings prepared by filtered cathodic arc deposition (CPCI-S收录) 会议 作者:  Xiao, Shu[1,3];  Wu, Zhongzhen[1];  Liu, Liangliang[1];  Fu, Ricky K. Y.[3];  Li, Wan[3] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ti/TiC  Wave soldering holder  FCVA  Tin-repellent