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Electroplating Low Coercivity Nanocrystalline Fe-Ni Magnetic Cores for High Performance On-Chip Microinductor
期刊论文
IEEE TRANSACTIONS ON MAGNETICS, 2022, 卷号: 58, 期号: 4, 页码: 7
作者:
Gao, Li-Yin
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2022/07/14
Fe-Ni
magnetic core
magnetic properties
nanocrystalline
on-chip microinductor
Design and Control of an Underactuated Finger Exoskeleton for Assisting Activities of Daily Living
期刊论文
IEEE-ASME TRANSACTIONS ON MECHATRONICS, 2021, 页码: 11
作者:
Li, Houcheng
;
Cheng, Long
;
Sun, Ning
;
Cao, Ran
收藏
  |  
浏览/下载:38/0
  |  
提交时间:2022/01/27
Exoskeletons
Grasping
Electronics packaging
Kinematics
Senior citizens
Robots
Shape
Admittance control
assistance
finger exoskeleton
preshaping
shape-adaptive grasping
underactuation
A Chip-Level Optical Interconnect for CPU
期刊论文
IEEE PHOTONICS TECHNOLOGY LETTERS, 2021, 卷号: 33, 期号: 16, 页码: 852-855
作者:
Hao, Qinfen
;
Qin, Mengyuan
;
Qi, Nan
;
Xue, Haiyun
;
Han, Meng
收藏
  |  
浏览/下载:48/0
  |  
提交时间:2021/12/01
Integrated optics
Optical interconnections
Transceivers
Adaptive optics
Optical switches
Optical sensors
Power demand
Optical interconnections
digital integrated circuits
very high speed integrated circuits
chip scale packaging
system integration
Stitching Graphene Sheets with Graphitic Carbon Nitride: Constructing a Highly Thermally Conductive rGO/g-C3N4 Film with Excellent Heating Capability
期刊论文
ACS APPLIED MATERIALS & INTERFACES, 2021, 卷号: 13
作者:
Wang, Yanyan
;
Zhang, Xian
;
Ding, Xin
;
Li, Ya
;
Wu, Bin
收藏
  |  
浏览/下载:64/0
  |  
提交时间:2021/04/26
graphene
graphitic carbon nitride
thermal conductivity
solar-thermal response
electric-thermal response
Design and Validation of a Self-Aligning Index Finger Exoskeleton for Post-Stroke Rehabilitation
期刊论文
IEEE TRANSACTIONS ON NEURAL SYSTEMS AND REHABILITATION ENGINEERING, 2021, 卷号: 29, 页码: 1513-1523
作者:
Sun, Ning
;
Li, Guotao
;
Cheng, Long
收藏
  |  
浏览/下载:25/0
  |  
提交时间:2021/11/02
Exoskeletons
Indexes
Kinematics
Training
Force
Electronics packaging
Task analysis
Finger exoskeleton
self-aligning mechanism
kinematic compatibility
kineto-statics
The oxidation effect on the cracking behavior of a Co-based alloy under thermal shocks
期刊论文
Corrosion Science, 2020, 卷号: 173
作者:
Wen, Junxia
;
Cao, Rui
;
Che, Hongyan
;
Dong, Hao
;
Zhang, Haiyan
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Cracks
Electronics packaging
Oxidation
Thermal expansion
Thermal shock
Co-based alloys
Coefficients of thermal expansions
Cracking behavior
Oxidation behaviors
Oxidation effects
Sample surface
Static conditions
Volume change
A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules
会议论文
Hong Kong, China, August 12, 2019 - August 15, 2019
作者:
Tian, Jun
;
Wang, Congsi
;
Liu, Shaoyi
;
Zhu, Cheng
;
Zhou, Cheng
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2021/07/06
Microwave circuits
Belts
Electronics packaging
Flexible electronics
Gold
Integrated circuit interconnects
Microwaves
Timing circuits
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
期刊论文
Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81
作者:
Liu, Yun
;
Yu, Weiyuan
;
Sun, Xuemin
;
Wang, Fengfeng
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Binary alloys
Dissolution
Electronics packaging
Energy dispersive spectroscopy
Intermetallics
Lead-free solders
Morphology
Needles
Scanning electron microscopy
Shear flow
Soldered joints
Soldering
Tin
Tin alloys
Tin metallography
Ultrasonic effects
Ultrasonic waves
Uranium metallography
Vanadium metallography
Design/methodology/approach
Dispersion strengthening
Energy dispersive X ray spectroscopy
Fractured surfaces
Grain morphologies
Grooves
Ultrasonic cavitation
Ultrasonic vibration
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks
期刊论文
Materials and Design, 2020, 卷号: 188
作者:
Wen, Junxia
;
Che, Hongyan
;
Cao, Rui
;
Dong, Hao
;
Ye, Youxiong
收藏
  |  
浏览/下载:16/0
  |  
提交时间:2020/11/14
Carbides
Electronics packaging
Hot isostatic pressing
Mechanical properties
Microstructural evolution
Nanoindentation
Scanning electron microscopy
Sintering
Thermal fatigue
Thermal shock
Carbide particles
Cobalt base alloys
Cobalt based alloy
Energy dispersion spectrum
High stress concentration
Nanoindentation tests
Reduced modulus
Thermal fatigue cracks
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks
会议论文
作者:
Wen, Junxia
;
Che, Hongyan
;
Cao, Rui
;
Dong, Hao
;
Ye, Youxiong
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/12/18
Carbides
Electronics packaging
Hot isostatic pressing
Mechanical properties
Microstructural evolution
Nanoindentation
Scanning electron microscopy
Sintering
Thermal fatigue
Thermal shockCarbide particles
Cobalt base alloys
Cobalt based alloy
Energy dispersion spectrum
High stress concentration
Nanoindentation tests
Reduced modulus
Thermal fatigue cracks
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