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	Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录)
	Tang, Y.[1]; Luo, S.M.[1]; Huang, W.F.[1]; Pan, Y.C.[2]; Li, G.Y.[2]
刊名	Journal of Alloys and Compounds
	2017
卷号	719页码:365-375
关键词	Brittle fracture Copper alloys Ductile fracture Fracture Intermetallics Lead free solders Manganese Nanoparticles Scanning electron microscopy Silver Silver alloys Soldered joints Soldering alloys Strain rate Tensile properties Tensile testing Tin Tin alloys
URL标识	查看原文
内容类型	期刊论文
URI标识	http://www.corc.org.cn/handle/1471x/2186118
专题	华南理工大学
作者单位	1.[1] College of Automation, Zhongkai University of Agriculture and Engineering, Guangzhou 2.510225, China 3.[2] School of Electronic and Information Engineering, South China University of Technology, Guangzhou 4.510641, China
推荐引用方式 GB/T 7714	Tang, Y.[1],Luo, S.M.[1],Huang, W.F.[1],等. Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录)[J]. Journal of Alloys and Compounds,2017,719:365-375.
APA	Tang, Y.[1],Luo, S.M.[1],Huang, W.F.[1],Pan, Y.C.[2],&Li, G.Y.[2].(2017).Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录).Journal of Alloys and Compounds,719,365-375.
MLA	Tang, Y.[1],et al."Effects of Mn nanoparticles on tensile properties of low-Ag Sn-0.3Ag-0.7Cu-xMn solder alloys and joints (EI收录)".Journal of Alloys and Compounds 719(2017):365-375.

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