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	Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection (EI收录)
	Zhang, X.P.[1]; Yu, C.B.[1]; Zhang, Y.P.[1]; Shrestha, S.[2]; Dorn, L.[2]
会议名称	Journal of Materials Processing Technology
会议日期	December 4, 2006 - December 6, 2006
会议地点	Singapore, Singapore
关键词	Creep Laser beams Lead Silver Soldering alloys Tin alloys
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2101211
专题	华南理工大学
作者单位	1.[1] Institute of Materials Science and Technology, School of Mechanical Engineering, South China University of Technology, Guangzhou 510640, China 2.[2] Institut Für Werkzeugmaschinen Und Fabrikbetrieb [IWF], Technical University Berlin, D-10587 Berlin, Germany
推荐引用方式 GB/T 7714	Zhang, X.P.[1],Yu, C.B.[1],Zhang, Y.P.[1],等. Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection (EI收录)[C]. 见:Journal of Materials Processing Technology. Singapore, Singapore. December 4, 2006 - December 6, 2006.

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