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	Effect of dopant on microstructure and mechanical properties of Pb-free solder joints (EI收录)
	Li, G.Y.[1]
会议名称	Proceedings of the Electronic Packaging Technology Conference, EPTC
会议日期	August 14, 2007 - August 17, 2007
会议地点	Shanghai, China
关键词	Activation energy Alloys Brazing Copper Copper alloys Electronics packaging Lead Mechanical properties Semiconducting intermetallics Silver Silver alloys Soldering alloys Technology Tin alloys Welding
URL标识	查看原文
内容类型	会议论文
URI标识	http://www.corc.org.cn/handle/1471x/2101695
专题	华南理工大学
作者单位	[1] Institute of Microelectronics, South China University of Technology, Guangzhou 510640, China
推荐引用方式 GB/T 7714	Li, G.Y.[1]. Effect of dopant on microstructure and mechanical properties of Pb-free solder joints (EI收录)[C]. 见:Proceedings of the Electronic Packaging Technology Conference, EPTC. Shanghai, China. August 14, 2007 - August 17, 2007.

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