Research on Bi contents addition into Sn-Cu-based lead-free solder alloy

doi:10.1007/s10854-022-08464-7

	Research on Bi contents addition into Sn-Cu-based lead-free solder alloy
	Huang, Hai 1; Chen, Bin 1; Hu, Xiaowu 1; Jiang, Xiongxin 1; Li, Qinglin 4; Che, Yinhui 2; Zu, Shuai 2; Liu, Dingjun 3
刊名	JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS
	2022-07-01
卷号	33 期号:19 页码:15586-15603
关键词	Binary alloysCopper corrosionCorrosion protectionCorrosion resistanceCorrosion resistant alloysCorrosive effectsDifferential scanning calorimetryElectrochemical corrosionElectrochemical impedance spectroscopyLead alloysLead-free soldersPassivationScanning electron microscopySemiconductor dopingTensile strengthThermodynamic propertiesTin alloysVickers hardness Cu-basedElectrochemicalsLead-free solder alloyMechanical performanceMechanical resistanceSolder alloysUndercoolingsUniversal testing machinesVicker hardnessX- ray diffractions
ISSN号	0957-4522
DOI	10.1007/s10854-022-08464-7
英文摘要	This work aimed to investigate the effects of some Bi additions (x = 0, 1, 3, and 5 wt%) added to Sn-2Cu solder alloy on its thermal properties, mechanical performance, and resistance to corrosion, which was investigated by using the Differential scanning calorimetry, Scanning electron microscope, Vickers Hardness Tester, Universal testing machine, Electrochemical workstation, and X-ray diffraction. The experimental results showed that doping 5 wt% Bi could reduce the melting point from 239.7 to 226.6 degrees C and the undercooling from 24.0 to 9.0 degrees C, which could improve the thermal properties. Moreover, the Bi addition could refine the microstructure and decrease the Cu6Sn5 IMC phases' size. With the addition of 5 wt% Bi, the microhardness and tensile strength reached the highest value of 20.13 HV and 57.64 MPa, respectively, due to the solid solution strengthening and precipitation strengthening. The electrochemical corrosion behaviors were performed to use the potentiodynamic polarization and electrochemical impedance spectroscopy. The obtained results revealed that a dense passivation film was formed on the surface of Sn-2Cu-1Bi alloy to prevent the alloy from being further corroded, which had the lowest value of corrosion current density (0.034 mu A center dot cm(-2)) and biggest value of total resistance (200.4 k omega center dot cm(2)). Therefore, the Sn-2Cu-1Bi alloy had best corrosion resistance.
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	SPRINGER
WOS记录号	WOS:000807989900006
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/158921]
专题	材料科学与工程学院
作者单位	1.Nanchang Univ, Sch Adv Mfg, Nanchang 330031, Jiangxi, Peoples R China; 2.Suzhou Nucl Power Res Inst Co Ltd, Shenzhen 518120, Peoples R China; 3.Nanchang Univ, Inst Adv Study, Nanchang 330031, Jiangxi, Peoples R China 4.Lanzhou Univ Technol, Sch Mat Sci & Engn, Lanzhou 730050, Peoples R China;
推荐引用方式 GB/T 7714	Huang, Hai,Chen, Bin,Hu, Xiaowu,et al. Research on Bi contents addition into Sn-Cu-based lead-free solder alloy[J]. JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,2022,33(19):15586-15603.
APA	Huang, Hai.,Chen, Bin.,Hu, Xiaowu.,Jiang, Xiongxin.,Li, Qinglin.,...&Liu, Dingjun.(2022).Research on Bi contents addition into Sn-Cu-based lead-free solder alloy.JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS,33(19),15586-15603.
MLA	Huang, Hai,et al."Research on Bi contents addition into Sn-Cu-based lead-free solder alloy".JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS 33.19(2022):15586-15603.