CORC

在结果中检索

CORC

浏览/检索结果: 共18条，第1-10条 帮助

限定条件    
已选(0)清除 条数/页：   排序方式：
Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites 期刊论文
COMPOSITES COMMUNICATIONS, 2020, 卷号: 22
作者:  He, Jing;  Wang, Hua;  Qu, Qiqi;  Su, Zheng;  Qin, Tengfei
收藏  |  浏览/下载：22/0  |  提交时间：2021/03/15
The application of the scallop nanostructure in deep silicon etching 期刊论文
NANOTECHNOLOGY, 2020, 卷号: 31, 期号: 31, 页码: 1-11
作者:  Lin, Yuanwei;  Yuan, Renzhi;  Zhou, Ce;  Dong, Zihan;  Su, Ziduo
收藏  |  浏览/下载：46/0  |  提交时间：2021/09/14
The open-pin failure of power device under the combined effect of thermo-migration and electro-migration 期刊论文
Chinese Science Bulletin, 2020, 卷号: 65, 期号: 20, 页码: 2169-2177
作者:  Gao Liyin;  Li Caifu;  Cao Lihua;  Liu Zhiquan
收藏  |  浏览/下载：15/0  |  提交时间：2021/02/03
Effect of AlN addition on phase formation in the LTCC with Al2O3/AlN biphasic ceramics based on BBSZ glass 期刊论文
CERAMICS INTERNATIONAL, 2020, 卷号: 46
作者:  Feng, Xiangyan;  Lv, Yuanyuan;  Zhang, Lan;  Ge, Daowen;  Li, Xiaoxiao
收藏  |  浏览/下载：61/0  |  提交时间：2020/11/26
Effect of Co addition into Ni film on shear strength of solder/Ni/Cu system: Experimental and theoretical investigations 期刊论文
MATERIALS SCIENCE AND ENGINEERING A-STRUCTURAL MATERIALS PROPERTIES MICROSTRUCTURE AND PROCESSING, 2020, 卷号: 788
作者:  Bi, Xiaoyang;  Hu, Xiaowu;  Li, Qinglin
收藏  |  浏览/下载：16/0  |  提交时间：2022/03/01
Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
作者:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan
收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：16/0  |  提交时间：2021/02/02
Synthesis of Sn nanowire by template electrodeposition and its conversion into Sn nanosolder 期刊论文
MATERIALS CHARACTERIZATION, 2020, 卷号: 163, 页码: 9
作者:  Meng, Zhi-Chao;  Gao, Li-Yin;  Liu, Zhi-Quan
收藏  |  浏览/下载：17/0  |  提交时间：2021/02/02
A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules 会议论文
Hong Kong, China, August 12, 2019 - August 15, 2019
作者:  Tian, Jun;  Wang, Congsi;  Liu, Shaoyi;  Zhu, Cheng;  Zhou, Cheng
收藏  |  浏览/下载：20/0  |  提交时间：2021/07/06
Gradient growth of fcc and bcc phase within FexNi1-x (50 < x < 75) films during direct-current wafer electroplating 期刊论文
JOURNAL OF MAGNETISM AND MAGNETIC MATERIALS, 2020, 卷号: 498, 页码: 6
作者:  Gao, Li-Yin;  Wan, Peng;  Liu, Zhi-Quan
收藏  |  浏览/下载：6/0  |  提交时间：2021/02/02

©版权所有 ©2017 CSpace - Powered by CSpace