Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites

doi:10.1016/j.coco.2020.100448

	Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites
	He, Jing 1,2,3; Wang, Hua 2,3; Qu, Qiqi 1,2,3; Su, Zheng 1,2,3; Qin, Tengfei 1,2,3; Da, Yunsheng 1,2,3; Tian, Xingyou 2,3
刊名	COMPOSITES COMMUNICATIONS
	2020-12-01
卷号	22
关键词	GO-SiC structure Epoxy resin Thermal conductivity Reliability
ISSN号	2452-2139
DOI	10.1016/j.coco.2020.100448
通讯作者	Wang, Hua(wanghua@issp.ac.cn) ; Tian, Xingyou(xytian@issp.ac.cn)
英文摘要	Graphene oxide (GO) has been widely used in modern electronic packaging materials because of its excellent performance. Nevertheless, inherently electrical conductivity and hygroscopicity of GO would greatly reduce the reliability of polymer composites as electronic packaging materials. In this work, different ratio GO and functionalized silicon carbide (SiC) particles formed an effective thermal conduction path through electrostatic self-assembly in epoxy resin (ER). SiC particles also played a critical role in enhancing the reliability of epoxy composites due to hydrophobicity and poor electrical properties. The obtained composites, at the optimal ratio of GO and SiC particles of 1:100, exhibited a high thermal conductivity (0.91 W/(mK)). The composites also presented that the thermal conductivity and electrical insulating were not destroyed after 40 h of wet-heat treatment. This strategy provided an insight into the design of high-performance composites with the potential to be used in advanced electronic packaging.
资助项目	National Key R&D Program of China[2017YFB0406200] ; Major science and technology projects of Anhui Province[18030901083] ; Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences[KFJ-STS-ZDTP-069] ; Strategic Priority Research Program of the Chinese Academy of Science[XDA13040505] ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences (guide project for innovative and entrepreneurial)[KFJ-STS-SCYD-112] ; Key deployment project of the Chinese Academy of Sciences[KFZD-SW-416] ; Science and Technology Cooperation Project of Sichuan Province and the Chinese Academy of Sciences[2017JZ0028]
WOS关键词	GRAPHENE AEROGEL
WOS研究方向	Materials Science
语种	英语
出版者	ELSEVIER SCI LTD
WOS记录号	WOS:000604639500005
资助机构	National Key R&D Program of China ; Major science and technology projects of Anhui Province ; Key Project of Science and Technology Service Network Initiative of the Chinese Academy of Sciences ; Strategic Priority Research Program of the Chinese Academy of Science ; Science and Technology Service Network Initiative of the Chinese Academy of Sciences (guide project for innovative and entrepreneurial) ; Key deployment project of the Chinese Academy of Sciences ; Science and Technology Cooperation Project of Sichuan Province and the Chinese Academy of Sciences
内容类型	期刊论文
源URL	[http://ir.hfcas.ac.cn:8080/handle/334002/120053]
专题	中国科学院合肥物质科学研究院
通讯作者	Wang, Hua; Tian, Xingyou
作者单位	1.Univ Sci & Technol China, Hefei 230026, Peoples R China 2.Chinese Acad Sci, Inst Solid State Phys, Hefei Inst Phys Sci, Hefei 230031, Peoples R China 3.Key Lab Photovolta & Energy Conservat Mat, Hefei, Peoples R China
推荐引用方式 GB/T 7714	He, Jing,Wang, Hua,Qu, Qiqi,et al. Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites[J]. COMPOSITES COMMUNICATIONS,2020,22.
APA	He, Jing.,Wang, Hua.,Qu, Qiqi.,Su, Zheng.,Qin, Tengfei.,...&Tian, Xingyou.(2020).Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites.COMPOSITES COMMUNICATIONS,22.
MLA	He, Jing,et al."Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites".COMPOSITES COMMUNICATIONS 22(2020).