Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging | |
Wang, Changchang1,2; Chen, Yinbo1,2; Liu, Zhi-Quan1,2,3 | |
刊名 | ACTA METALLURGICA SINICA-ENGLISH LETTERS |
2020-05-15 | |
卷号 | 33期号:10页码:9 |
关键词 | Cu-Sn IMC Growth behavior External stress effect Isothermal aging |
ISSN号 | 1006-7191 |
DOI | 10.1007/s40195-020-01059-3 |
通讯作者 | Liu, Zhi-Quan(zqliu@siat.ac.cn) |
英文摘要 | A U-shape clamp was designed to apply stress perpendicular to the interface of Cu/Sn/Cu solder joints, and its influence on the growth behavior of Cu-Sn intermetallic compound (IMC) during thermal aging at 150 degrees C was investigated. The results show that compared with the sample at general stress-free state, the growth rate of IMC under compression is faster, while that under tension is slower. Moreover, the interface between IMC and Sn is smoother under compressive stress, and the corresponding IMC grains are smaller and more uniform than that under tensile stress. According to the growth kinetic analysis, the growth of IMC under general, compressive and tensile states is all controlled by the combination of grain boundary diffusion and volume diffusion with a similar growth exponent (n approximate to 0.4). However, external stress can affect the Ostwald ripening process of grain growth, causing a change of grain size and grain boundary density in the IMC layer. As a result, the IMC growth behavior at the interface of the solder joint will be affected by the applied external normal stress. |
资助项目 | National Key R&D Program of China[2017YFB0305501] ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission)[2017-934] |
WOS研究方向 | Metallurgy & Metallurgical Engineering |
语种 | 英语 |
出版者 | CHINESE ACAD SCIENCES, INST METAL RESEARCH |
WOS记录号 | WOS:000533049300003 |
资助机构 | National Key R&D Program of China ; National and Local Joint Engineering Laboratory of Advanced Electronic Packaging Materials (Shenzhen Development and Reform Commission) |
内容类型 | 期刊论文 |
源URL | [http://ir.imr.ac.cn/handle/321006/138790] |
专题 | 金属研究所_中国科学院金属研究所 |
通讯作者 | Liu, Zhi-Quan |
作者单位 | 1.Chinese Acad Sci, Inst Met Res, Shenyang 110016, Peoples R China 2.Univ Sci & Technol China, Sch Mat Sci & Engn, Shenyang 110016, Peoples R China 3.Chinese Acad Sci, Shenzhen Inst Adv Elect Mat, Shenzhen Inst Adv Technol, Shenzhen 518055, Peoples R China |
推荐引用方式 GB/T 7714 | Wang, Changchang,Chen, Yinbo,Liu, Zhi-Quan. Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging[J]. ACTA METALLURGICA SINICA-ENGLISH LETTERS,2020,33(10):9. |
APA | Wang, Changchang,Chen, Yinbo,&Liu, Zhi-Quan.(2020).Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging.ACTA METALLURGICA SINICA-ENGLISH LETTERS,33(10),9. |
MLA | Wang, Changchang,et al."Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging".ACTA METALLURGICA SINICA-ENGLISH LETTERS 33.10(2020):9. |
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