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	Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders 期刊论文 Microelectronics Reliability, 2020, 卷号: 111 作者: Lin, Qiaoli; Ye, Changsheng; Sui, Ran 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Amorphous alloys Binary alloys Copper alloys Lead alloys Nickel oxide Oxide films Silver alloys Ternary alloys Tin Crystalline alloys Interfacial reactivity Minimum surfaces Primary crystallization Sn-based solders Volume shrinkage Wetting balance methods Wetting mechanism
	Wettability of amorphous and crystalline Co73Si10B17 by lead-free solders 期刊论文 Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals, 2020, 卷号: 30, 期号: 6, 页码: 1329-1337 作者: Ye, Chang-Sheng; Ci, Wen-Juan; Lin, Qiao-Li; Sui, Ran; Wang, Jian-Bin 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Binary alloys Cobalt alloys Copper alloys Descaling Free energy Lead-free solders Oxide films Silicon Silicon compounds Silver alloys Surface reactions Ternary alloys Tin Wetting Co-based alloys Crystalline state Sn-based solders Surface free energy Surface oxide films Temperature range Wetting balance methods Wetting mechanism
	Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 4, 页码: 90-96 作者: Sui, Ran; Lin, Qiaoli 收藏 \| 浏览/下载：5/0 \| 提交时间：2020/11/14 Contact angle Copper alloys Microstructure Monocrystalline silicon Oxide films Silicon alloys Silver alloys Tin alloys Titanium alloys Titanium oxides Active components Dissolution-reprecipitation Monocrystalline Solid/liquid interfaces Temperature dependent Temperature-induced Wetting behavior Wetting mechanism
	Wetting behavior of Cu6Sn5 IMC by molten Sn 期刊论文 Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 3, 页码: 33-37 作者: Li, Fuxiang; Wang, Jianbin; Ye, Changsheng; Lin, Qiaoli 收藏 \| 浏览/下载：2/0 \| 提交时间：2020/11/14 Activation energy Binary alloys Gold Oxide films Substrates Tin compounds Ion sputtering Linear variation Metallic substrate Modified sessile drop method Reaction limiteds Spreading dynamics Wetting behavior Wetting process
	Reactive wetting of Sn-V solder alloys on polycrystalline CVD diamond 期刊论文 Applied Surface Science, 2020, 卷号: 504 作者: Liao, Xinjiang; He, Qiqi; Lin, Qiaoli; Mu, Dekui; Huang, Hui 收藏 \| 浏览/下载：3/0 \| 提交时间：2020/11/14 Adsorption Binary alloys Chemical bonds Chemical vapor deposition Lead-free solders Reaction kinetics Synthetic diamonds Tin compounds Wetting Bonding techniques Chemical vapour deposition CVD Diamond Interface reactions Polycrystalline CVD diamond Precursor films Sessile drop method Spreading kinetics
	Influence of additives on electroplated copper films and shear strength of SAC305/Cu solder joints 期刊论文 JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2020, 卷号: 31, 期号: 3, 页码: 2320-2330 作者: Zhang, Xudong; Hu, Xiaowu; Jiang, Xiongxin; Zhou, Liuru; Li, Qinglin 收藏 \| 浏览/下载：11/0 \| 提交时间：2020/06/16 Additives Atomic force microscopy Binary alloys Chlorine compounds Copper Copper compounds Electron probe microanalysis Electrons High resolution transmission electron microscopy Metallic films Scanning electron microscopy Tin alloys Tin metallography X ray photoelectron spectroscopy Crystallographic orientations Electron back scatter diffraction Electroplated copper film Electroplated Cu films Impurity incorporation Micro-structural characterization Microstructural instability Plating solutions
	Influence of benzotriazole on electroplated Cu films and interfacial microstructure evolution of solder joints 期刊论文 Journal of Materials Science: Materials in Electronics, 2019, 卷号: 30, 期号: 24, 页码: 21126-21137 作者: Yi, Xiong; Yi, Guangbin; Hu, Xiaowu; Li, Qinglin; Zhang, Ruhua 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Atomic force microscopy Coatings Copper compounds Electroplating Gold Growth rate Lead-free solders Metallic films Scanning electron microscopy Semiconductor doping Silver alloys Silver metallography Soldering Substrates Surface roughness Ternary alloys Thermal aging Tin alloys Tin compounds Tin metallography X ray photoelectron spectroscopy Benzotriazole(BTA) Electroplated Cu films Heterocyclic compound Interfacial microstructure evolution Isothermal aging Kovar substrates Low concentrations Soldering process
	Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C 期刊论文 Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668 作者: Sui, Ran; Li, Fuxiang; Ci, Wenjuan; Lin, Qiaoli 收藏 \| 浏览/下载：1/0 \| 提交时间：2020/11/14 Bismuth alloys Copper Copper oxides Joining Oxide films Phase interfaces Soldering Ternary alloys Tin compounds Wetting Cu intermetallics IMC layer Interfacial reactivity Interfacial structures Sessile drop method Sn-Bi alloy Spreading characteristics Ternary phase diagrams
	Optimization of the nucleation-site density for the electrodeposition of cadmium sulfide on indium-tin-oxide 期刊论文 Electrochimica Acta, 2019 作者: Sheng Shen; Xiaoyue Zhang; Syed Mubeen; Manuel P. Soriaga; John L. Stickney 收藏 \| 浏览/下载：7/0 \| 提交时间：2019/12/13 Indium-tin-oxide Nucleation and Growth E-ALD Cadmium Sulfide Semiconductor Thin Films
	Optimization of the nucleation-site density for the electrodeposition of cadmium sulfide on indium-tin-oxide 期刊论文 Electrochimica Acta, 2019, 卷号: Vol.316, 页码: 105-112 作者: Sheng Shen; Xiaoyue Zhang; Syed Mubeen; Manuel P. Soriaga; John L. Stickney 收藏 \| 浏览/下载：6/0 \| 提交时间：2019/12/13 Indium-tin-oxide Nucleation and growth E-ALD Cadmium sulfide Semiconductor thin films

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