Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders

doi:10.1016/j.microrel.2020.113722

	Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders
	Lin, Qiaoli 2; Ye, Changsheng 2; Sui, Ran 1
刊名	Microelectronics Reliability
	2020-08-01
卷号	111
关键词	Amorphous alloys Binary alloys Copper alloys Lead alloys Nickel oxide Oxide films Silver alloys Ternary alloys Tin Crystalline alloys Interfacial reactivity Minimum surfaces Primary crystallization Sn-based solders Volume shrinkage Wetting balance methods Wetting mechanism
ISSN号	00262714
DOI	10.1016/j.microrel.2020.113722
英文摘要	Using wetting balance method, the wettability of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders (Sn-0.7Cu, Sn-0.3Ag-0.7Cu, and eutectic SnPb (E-SnPb, Sn63Pb37)) was evaluated at 290–310 °C. Among these solders, Sn shows the best wettability with amorphous alloy because of the strongest interfacial reactivity for oxide film removal, and E-SnPb shows the best wettability with crystalline alloy due to the minimum surface tension of E-SnPb solder. Generally, amorphous alloys have the better wettability. At least two factors caused this situation, i.e., the relatively larger surface energy of amorphous alloy and the volume shrinkage caused by the structural relaxation and the primary crystallization during wetting. In this study, the wetting mechanism actually is the deoxideation, which includes the reaction of Sn with NiO, and the mechanical removal of the oxide film. © 2020 Elsevier Ltd
WOS研究方向	Engineering ; Science & Technology - Other Topics ; Physics
语种	英语
出版者	Elsevier Ltd
WOS记录号	WOS:000552136100021
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/115265]
专题	材料科学与工程学院
作者单位	1.Department of Materials Science and Engineering, Lanzhou Institute of Technology, No.1 Gongjiaping East Road, Lanzhou; 730050, China 2.State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou University of Technology, No.287 Langongping Road, Lanzhou; 730050, China;
推荐引用方式 GB/T 7714	Lin, Qiaoli,Ye, Changsheng,Sui, Ran. Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders[J]. Microelectronics Reliability,2020,111.
APA	Lin, Qiaoli,Ye, Changsheng,&Sui, Ran.(2020).Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders.Microelectronics Reliability,111.
MLA	Lin, Qiaoli,et al."Wetting of Ni-based amorphous and crystalline alloys by Sn and Sn-based solders".Microelectronics Reliability 111(2020).