Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys

doi:10.12073/j.hjxb.20191122001

	Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys
	Sui, Ran 2; Lin, Qiaoli 1
刊名	Hanjie Xuebao/Transactions of the China Welding Institution
	2020-04-25
卷号	41 期号:4 页码:90-96
关键词	Contact angle Copper alloys Microstructure Monocrystalline silicon Oxide films Silicon alloys Silver alloys Tin alloys Titanium alloys Titanium oxides Active components Dissolution-reprecipitation Monocrystalline Solid/liquid interfaces Temperature dependent Temperature-induced Wetting behavior Wetting mechanism
ISSN号	0253360X
DOI	10.12073/j.hjxb.20191122001
英文摘要	The wetting behavior of molten Sn0.3Ag0.7Cu (SAC)-xTi (x=wt.%) on the surface of monocrystalline Si at 800-900 was studied under high vacuum by the modified drop method. The results show that SAC-xTi/Si system belongs to the inert wetting system, and the Ti addition improved wettability, significantly. Without Ti addition, the system achieved the equilibrium contact angle of 63° after 1 800 s at 800; With 1% Ti addition, the system achieved the lowest equilibrium contact angle of 41° after 1 800 s at 900; With 3% Ti addition, the system achieved the fastest spreading in 50 s at 900. The wetting mechanism is that the active component Ti accelerates the removal of oxide film on the surface of monocrystalline Si. During the spreading process of the molten solder, the temperature-dependent "pyramid" microstructure was formed at the solid/liquid interface through dissolution-reprecipitation mechanism and micro-mask mechanism, i.e., the higher temperature induced the sparse and larger "pyramid" microstructures. The appearance of "pyramid" microstructures did not improve the wettability of the system, on the contrary, the wettability became worse due to the pinning of the triple line. © 2020, Editorial Board of Transactions of the China Welding Institution, Magazine Agency Welding. All right reserved.
语种	中文
出版者	Harbin Research Institute of Welding
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/115337]
专题	材料科学与工程学院
作者单位	1.State Key Laboratory of Advanced Processing and Recycling of Non-ferrous Metal, Lanzhou University of Technology, Lanzhou; 730050, China 2.Lanzhou Institute of Technology, Lanzhou; 730050, China;
推荐引用方式 GB/T 7714	Sui, Ran,Lin, Qiaoli. Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys[J]. Hanjie Xuebao/Transactions of the China Welding Institution,2020,41(4):90-96.
APA	Sui, Ran,&Lin, Qiaoli.(2020).Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys.Hanjie Xuebao/Transactions of the China Welding Institution,41(4),90-96.
MLA	Sui, Ran,et al."Wetting behavior of monocrystalline Si by SnAgCu-xTi alloys".Hanjie Xuebao/Transactions of the China Welding Institution 41.4(2020):90-96.