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CORC

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Influence of External Interface Normal Stress on the Growth of Cu-Sn IMC During Aging 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2020, 卷号: 33, 期号: 10, 页码: 9
作者:  Wang, Changchang;  Chen, Yinbo;  Liu, Zhi-Quan
收藏  |  浏览/下载：7/0  |  提交时间：2021/02/02
Structure and properties of Sn-Cu lead-free solders in electronics packaging 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 421-444
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-Quan;  Xiong, Ming-Yue;  Sun, Lei
收藏  |  浏览/下载：129/0  |  提交时间：2021/02/02
Wetting of Cu and Cu-Sn IMCs by Sn-Bi Alloys over Wide Composition at 350°C 期刊论文
Journal of Electronic Materials, 2019, 卷号: 48, 期号: 7, 页码: 4660-4668
作者:  Sui, Ran;  Li, Fuxiang;  Ci, Wenjuan;  Lin, Qiaoli
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/14
Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling 期刊论文
Journal of Electronic Materials, 2015, 卷号: 44, 期号: 1, 页码: 590-596
L. M.; Zhang Yang, Z. F.
收藏  |  浏览/下载：24/0  |  提交时间：2015/05/08
Growth mechanism of duplex structural Cu-2(In,Sn) compound on single crystalline Cu substrate 期刊论文
Journal of Alloys and Compounds, 2014, 卷号: 588, 页码: 662-667
F. F. Tian; Z. Q. Liu
收藏  |  浏览/下载：33/0  |  提交时间：2014/03/14
The growth behavior of IMC on the Sn/Cu interface during solidification of multiple reflows 会议论文
15th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Chengdu, PEOPLES R CHINA, 2014-08-12
作者:  Li, Shuang;  Du, Yao;  Qu, Lin;  Kunwar, Anil;  Sun, Junhao
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09
Dissolutive wetting process and interfacial characteristic of molten Sn-17Bi-0.5Cu alloy on copper substrate 期刊论文
稀有金属, 2013
Xu, Bing-Sheng; Zang, Li-Kun; Yuan, Zhang-Fu; Wu, Yan; Zhou, Zhou
收藏  |  浏览/下载：3/0  |  提交时间：2015/11/10
Drop Failure Modes of A Wafer-Level Chip-Scale Packaging 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Huang, Mingliang;  Liu, Shuang;  Zhao, Ning;  Long, Haohui;  Li, Jianhui
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/11
The study of cooling process' effect on the growth of IMC at Sn-3.5Ag/Cu soldering interface 会议论文
14th International Conference on Electronic Packaging Technology (ICEPT), Chinese Inst Elect, Dalian, PEOPLES R CHINA, 2013-08-11
作者:  Zhao, Huijing;  Qu, Lin;  Li, Hua;  Zhao, Ning;  Ma, Haitao
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/11
时效Sn-0．3Ag-0．7Cu／OSP、ENIG焊点剪切强度的比较 期刊论文
《特种铸造及有色合金》, 2012, 卷号: 32, 页码: 1155-1158
作者:  戴宗倍[1];  卫国强[1];  薛明阳[1];  师磊[1]
收藏  |  浏览/下载：4/0  |  提交时间：2019/04/26

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