| Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling | |
| L. M. ; Zhang Yang, Z. F. | |
| 刊名 | Journal of Electronic Materials
 |
| 2015 | |
| 卷号 | 44期号:1页码:590-596 |
| 关键词 | Intermetallic compounds (IMC) solder joint cooling rate solidification adsorption ag-cu solder cu6sn5 grains in-situ sn alloy nanoparticles ag3sn microstructure technology particles |
| ISSN号 | 0361-5235 |
| 原文出处 | |
| 公开日期 | 2015-05-08 |
| 内容类型 | 期刊论文 |
| 源URL | [http://ir.imr.ac.cn/handle/321006/74002]  |
| 专题 | 金属研究所_中国科学院金属研究所 |
| 推荐引用方式 GB/T 7714 | L. M.,Zhang Yang, Z. F.. Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling[J]. Journal of Electronic Materials,2015,44(1):590-596. |
| APA | L. M.,&Zhang Yang, Z. F..(2015).Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling.Journal of Electronic Materials,44(1),590-596. |
| MLA | L. M.,et al."Growth Behavior of Intermetallic Compounds in Cu/Sn3.0Ag0.5Cu Solder Joints with Different Rates of Cooling".Journal of Electronic Materials 44.1(2015):590-596. |
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