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The CDAU - a common data acquisition unit for the radiation imaging detectors at HIRFL-CSR 期刊论文
JOURNAL OF INSTRUMENTATION, 2022, 卷号: 17, 期号: 1, 页码: 10
作者:  Zhang, H.;  Yang, H.;  Li, X.;  Zhao, C.
收藏  |  浏览/下载：7/0  |  提交时间：2022/04/11
Service Encapsulation Method Based on Industrial Internet 会议论文
Shanghai, China, March 18-19, 2022
作者:  Li, Kai;  Pan H(潘昊);  Tong X(佟星);  Li D(李栋);  Wang T(王挺)
收藏  |  浏览/下载：18/0  |  提交时间：2022/04/13
Design and Control of an Underactuated Finger Exoskeleton for Assisting Activities of Daily Living 期刊论文
IEEE-ASME TRANSACTIONS ON MECHATRONICS, 2021, 页码: 11
作者:  Li, Houcheng;  Cheng, Long;  Sun, Ning;  Cao, Ran
收藏  |  浏览/下载：39/0  |  提交时间：2022/01/27
The role of water transport in the failure of silicone rubber coating for implantable electronic devices 期刊论文
PROGRESS IN ORGANIC COATINGS, 2021, 卷号: 159, 页码: 10
作者:  Du, Shiyao;  Zhang, Yang;  Meng, Meijiang;  Tang, Ao;  Li, Ying
收藏  |  浏览/下载：37/0  |  提交时间：2021/11/22
The role of water transport in the failure of silicone rubber coating for implantable electronic devices 期刊论文
PROGRESS IN ORGANIC COATINGS, 2021, 卷号: 159, 页码: 10
作者:  Du, Shiyao;  Zhang, Yang;  Meng, Meijiang;  Tang, Ao;  Li, Ying
收藏  |  浏览/下载：33/0  |  提交时间：2021/11/22
Design and Validation of a Self-Aligning Index Finger Exoskeleton for Post-Stroke Rehabilitation 期刊论文
IEEE TRANSACTIONS ON NEURAL SYSTEMS AND REHABILITATION ENGINEERING, 2021, 卷号: 29, 页码: 1513-1523
作者:  Sun, Ning;  Li, Guotao;  Cheng, Long
收藏  |  浏览/下载：28/0  |  提交时间：2021/11/02
Advances in G-stack diode laser using macro-channel water cooling and high thermal conductivity material packaging 会议论文
Virtual, Online, United states, 2021-03-06
作者:  Han, Yang;  Sun, Lichen;  Fu, Tuanwei;  Gao, Lijun;  Zheng, Yanfang
收藏  |  浏览/下载：32/0  |  提交时间：2021/06/28
Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites 期刊论文
COMPOSITES COMMUNICATIONS, 2020, 卷号: 22
作者:  He, Jing;  Wang, Hua;  Qu, Qiqi;  Su, Zheng;  Qin, Tengfei
收藏  |  浏览/下载：23/0  |  提交时间：2021/03/15
A Structure and Circuit Coupling Modeling Method for Flexible Interconnection Points and Transmission Performance of Gold Belt in Microwave Modules 会议论文
Hong Kong, China, August 12, 2019 - August 15, 2019
作者:  Tian, Jun;  Wang, Congsi;  Liu, Shaoyi;  Zhu, Cheng;  Zhou, Cheng
收藏  |  浏览/下载：21/0  |  提交时间：2021/07/06
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文
Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81
作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng
收藏  |  浏览/下载：9/0  |  提交时间：2022/02/17

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