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CORC

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Ultra-low energy joining: An invisible strong bond at room temperature 期刊论文
JOURNAL OF THE EUROPEAN CERAMIC SOCIETY, 2019, 卷号: 39, 期号: 16, 页码: 5358
作者:  Ke, Daoyao;  Jiang, Anna;  Biesuz, Mattia;  Bortolotti, Mauro;  Taveri, Gianmarco
收藏  |  浏览/下载：59/0  |  提交时间：2019/12/26
Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure 期刊论文
SENSORS AND ACTUATORS A-PHYSICAL, 2018, 卷号: 281, 页码: 1-8
作者:  Li, Zhenhao;  Na, Shuai;  Chen, Albert I. H.;  Wong, Lawrence L. P.;  Sun, Zhendong
收藏  |  浏览/下载：31/0  |  提交时间：2018/11/16
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02
Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
A modified low-temperature wafer bonding method using spot pressing bonding technique and water glass adhesive layer 期刊论文
JAPANESE JOURNAL OF APPLIED PHYSICS, 2017
作者:  Chen DP(陈大鹏);  Wang YH(王英辉);  Wang SK(王盛凯);  Xu Y(徐杨)
收藏  |  浏览/下载：13/0  |  提交时间：2018/06/08
Thermally Reversible and Crosslinked Polyurethane based on Diels-Alder Chemistry for Ultrathin Wafer Temporary Bonding at Low-temperature 会议论文
Orlando，the USA
作者:  Jinhui Li;  Qiang Liu;  Guoping Zhang;  Bin Zhao;  Rong Sun
收藏  |  浏览/下载：21/0  |  提交时间：2018/02/02
DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12
作者:  Yao, Mingjun;  Yu, Daquan;  Zhao, Ning;  Fan, Jun;  Xiao, Zhiyi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Simplified low-temperature wafer-level hybrid bonding using pillar bump and photosensitive adhesive for three-dimensional integrated circuit integration 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2017, 卷号: 28, 页码: 9091-9095
作者:  Yao, Mingjun;  Fan, Jun;  Zhao, Ning;  Xiao, Zhiyi;  Yu, Daquan
收藏  |  浏览/下载：9/0  |  提交时间：2019/12/02

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