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CORC

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Self-Assembly of Ordered Microparticle Monolayers from Drying a Droplet on a Liquid Substrate 期刊论文
JOURNAL OF PHYSICAL CHEMISTRY LETTERS, 2019, 卷号: 10, 期号: 20, 页码: 6184-6188
作者:  Li WB(李伟斌);  Ji WJ(纪文杰);  Lan D(蓝鼎);  Wang YR(王育人)
收藏  |  浏览/下载：16/0  |  提交时间：2020/03/21
OGLE-2018-BLG-1011Lb,c: Microlensing Planetary System with Two Giant Planets Orbiting a Low-mass Star 期刊论文
The Astronomical Journal, 2019, 卷号: 158, 期号: 3
作者:  Han,Cheongho;  Bennett,David P.;  Udalski,Andrzej;  Gould,Andrew
收藏  |  浏览/下载：27/0  |  提交时间：2020/03/10
Spitzer Parallax of OGLE-2018-BLG-0596: A Low-mass-ratio Planet around an M Dwarf 期刊论文
The Astronomical Journal, 2019, 卷号: 158, 期号: 1
作者:  Jung,Youn Kil;  Gould,Andrew;  Udalski,Andrzej;  Sumi,Takahiro;  Yee,Jennifer C.
收藏  |  浏览/下载：22/0  |  提交时间：2020/03/10
KMT-2016-BLG-1397b: KMTNET-only Discovery of a Microlens Giant Planet 期刊论文
ASTRONOMICAL JOURNAL, 2018, 卷号: 156, 期号: 5, 页码: 9
作者:  Zang, Weicheng;  Hwang, Kyu-Ha;  Kim, Hyoun-Woo;  Gould, Andrew;  Wang, Tianshu
收藏  |  浏览/下载：13/0  |  提交时间：2020/03/10
Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文
19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02
Optimization and Characterization of Low-Temperature Wafer-Level Hybrid Bonding Using Photopatternable Dry Film Adhesive and Symmetric Micro Cu Pillar Solder Bumps 期刊论文
IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2018, 卷号: 8, 页码: 1855-1862
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：13/0  |  提交时间：2019/12/02
Development of Silicon Microstrip and Pixel Detectors for the European XFEL 影音
2016,
作者:  Zhang JG(张家国)
收藏  |  浏览/下载：32/0  |  提交时间：2016/09/29
基于激光相变热刻蚀效应的微纳结构制备 学位论文
硕士: 中国科学院上海光学精密机械研究所, 2016
作者:  周奇军
收藏  |  浏览/下载：19/0  |  提交时间：2016/11/28

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