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浏览/检索结果: 共8条，第1-8条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Process development and reliability for wafer-level 3D IC integration using micro-bump/adhesive hybrid bonding and via-last TSVs 会议论文 19th International Conference on Electronic Packaging Technology, ICEPT 2018, Shanghai, China, 2018-08-08 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：14/0  |  提交时间：2019/12/02 Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文 2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01 作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao 收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02 3D IC  wafer-level hybrid bonding  insert Cu pillar solder bump  dry film adhesive  TSVs  reliability   Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文 JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557 作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi 收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02 3D IC  micro-bump  B-stage adhesive film  wafer-level hybrid bonding  via-last TSVs   圆柱形硅通孔的二维解析电容模型 期刊论文 2016, 2016 张青青; 喻文健; 骆祖莹; ZHANG Qing-Qing; YU Wen-Jian; LUO Zu-Ying 收藏  |  浏览/下载：1/0 Fabricating Photosensitive Polymer Insulation Layer by Spin-coating for Through Silicon Vias 会议论文 The 17th International Conference on electronic packing Technology (ICEPT 2016), Changsha,China 作者:  Qiang Liu;  Guoping Zhang;  Rong Sun;  S. W. Ricky Lee;  C. P. Wong 收藏  |  浏览/下载：21/0  |  提交时间：2017/01/15 A Wafer Level Through-Stack-Via Integration Process with One-time Bottom-up Copper Filling 其他 2014-01-01 Zhu, Yunhui; Ma, Shenglin; Sun, Xin; Fang, Runiu; Zhong, Xiao; Bian, Yuan; Guan, Yong; Chen, Jing; Miao, Min; Jin, Yufeng 收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03 INTERCONNECTS   Modeling and analysis of TSV noise coupling and suppression methods for 20nm node and beyond 其他 2014-01-01 Fang, Runiu; Sun, Xin; Jin, Yufeng; Miao, Min 收藏  |  浏览/下载：6/0  |  提交时间：2015/11/17 Development of a Through-Stack-Via Integrated SRAM Module 其他 2012-01-01 Zhu, Yunhui; Sun, Xin; Ma, Shenglin; Cui, Qinghu; Zhong, Xiao; Bian, Yuan; Chen, Meng; Xiao, Yongqiang; Fang, Runiu; Liu, Zhenhua; Zhu, Zhiyuan; Gong, Xin; Chen, Jing; Miao, Min; Lu, Wengao; Jin, Yufeng 收藏  |  浏览/下载：5/0  |  提交时间：2015/11/16