| DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP | |
| Yao, Mingjun; Yu, Daquan; Zhao, Ning; Fan, Jun; Xiao, Zhiyi; Ma, Haitao | |
| 2017 | |
| 会议名称 | China Semiconductor Technology International Conference (CSTIC) |
| 会议日期 | 2017-03-12 |
| 会议地点 | Shanghai, PEOPLES R CHINA |
| 关键词 | Hybrid bonding 3D packaging Bump Polyimide Dry film |
| 页码 | - |
| 会议录 | China Semiconductor Technology International Conference (CSTIC)
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| URL标识 | 查看原文 |
| WOS记录号 | [DB:DC_IDENTIFIER_WOSID] |
| 内容类型 | 会议论文 |
| URI标识 | http://www.corc.org.cn/handle/1471x/3285550 |
| 专题 | 大连理工大学 |
| 作者单位 | 1.Dalian University of Technology, 116024, China 2.Huatian Technology Electronics Co., Ltd., 215300, China |
| 推荐引用方式 GB/T 7714 | Yao, Mingjun,Yu, Daquan,Zhao, Ning,et al. DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP[C]. 见:China Semiconductor Technology International Conference (CSTIC). Shanghai, PEOPLES R CHINA. 2017-03-12. |
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