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The CDAU - a common data acquisition unit for the radiation imaging detectors at HIRFL-CSR
期刊论文
JOURNAL OF INSTRUMENTATION, 2022, 卷号: 17, 期号: 1, 页码: 10
作者:
Zhang, H.
;
Yang, H.
;
Li, X.
;
Zhao, C.
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2022/04/11
Data acquisition circuits
Digital electronic circuits
Design and Control of an Underactuated Finger Exoskeleton for Assisting Activities of Daily Living
期刊论文
IEEE-ASME TRANSACTIONS ON MECHATRONICS, 2021, 页码: 11
作者:
Li, Houcheng
;
Cheng, Long
;
Sun, Ning
;
Cao, Ran
收藏
  |  
浏览/下载:39/0
  |  
提交时间:2022/01/27
Exoskeletons
Grasping
Electronics packaging
Kinematics
Senior citizens
Robots
Shape
Admittance control
assistance
finger exoskeleton
preshaping
shape-adaptive grasping
underactuation
The role of water transport in the failure of silicone rubber coating for implantable electronic devices
期刊论文
PROGRESS IN ORGANIC COATINGS, 2021, 卷号: 159, 页码: 10
作者:
Du, Shiyao
;
Zhang, Yang
;
Meng, Meijiang
;
Tang, Ao
;
Li, Ying
收藏
  |  
浏览/下载:37/0
  |  
提交时间:2021/11/22
Organic coatings
Failure mechanism
Implantable electronic devices
Water transfer
EIS
Finite element analysis
The role of water transport in the failure of silicone rubber coating for implantable electronic devices
期刊论文
PROGRESS IN ORGANIC COATINGS, 2021, 卷号: 159, 页码: 10
作者:
Du, Shiyao
;
Zhang, Yang
;
Meng, Meijiang
;
Tang, Ao
;
Li, Ying
收藏
  |  
浏览/下载:33/0
  |  
提交时间:2021/11/22
Organic coatings
Failure mechanism
Implantable electronic devices
Water transfer
EIS
Finite element analysis
Design and Validation of a Self-Aligning Index Finger Exoskeleton for Post-Stroke Rehabilitation
期刊论文
IEEE TRANSACTIONS ON NEURAL SYSTEMS AND REHABILITATION ENGINEERING, 2021, 卷号: 29, 页码: 1513-1523
作者:
Sun, Ning
;
Li, Guotao
;
Cheng, Long
收藏
  |  
浏览/下载:29/0
  |  
提交时间:2021/11/02
Exoskeletons
Indexes
Kinematics
Training
Force
Electronics packaging
Task analysis
Finger exoskeleton
self-aligning mechanism
kinematic compatibility
kineto-statics
Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites
期刊论文
COMPOSITES COMMUNICATIONS, 2020, 卷号: 22
作者:
He, Jing
;
Wang, Hua
;
Qu, Qiqi
;
Su, Zheng
;
Qin, Tengfei
收藏
  |  
浏览/下载:23/0
  |  
提交时间:2021/03/15
GO-SiC structure
Epoxy resin
Thermal conductivity
Reliability
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
期刊论文
Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81
作者:
Liu, Yun
;
Yu, Weiyuan
;
Sun, Xuemin
;
Wang, Fengfeng
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2022/02/17
Binary alloys
Dissolution
Electronics packaging
Energy dispersive spectroscopy
Intermetallics
Lead-free solders
Morphology
Needles
Scanning electron microscopy
Shear flow
Soldered joints
Soldering
Tin
Tin alloys
Tin metallography
Ultrasonic effects
Ultrasonic waves
Uranium metallography
Vanadium metallography
Design/methodology/approach
Dispersion strengthening
Energy dispersive X ray spectroscopy
Fractured surfaces
Grain morphologies
Grooves
Ultrasonic cavitation
Ultrasonic vibration
Performance evaluation and prediction of the integrated circuit industry in China: A hybrid method
期刊论文
SOCIO-ECONOMIC PLANNING SCIENCES, 2020, 卷号: 69, 页码: 12
作者:
Zhou, Xiaoyang
;
Chen, Hao
;
Chai, Jian
;
Wang, Shouyang
;
Lev, Benjamin
收藏
  |  
浏览/下载:23/0
  |  
提交时间:2020/05/24
Dynamic DEA
Projection analysis
Grey model
Integrated circuit industry
Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks
期刊论文
Materials and Design, 2020, 卷号: 188
作者:
Wen, Junxia
;
Che, Hongyan
;
Cao, Rui
;
Dong, Hao
;
Ye, Youxiong
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2020/11/14
Carbides
Electronics packaging
Hot isostatic pressing
Mechanical properties
Microstructural evolution
Nanoindentation
Scanning electron microscopy
Sintering
Thermal fatigue
Thermal shock
Carbide particles
Cobalt base alloys
Cobalt based alloy
Energy dispersion spectrum
High stress concentration
Nanoindentation tests
Reduced modulus
Thermal fatigue cracks
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method
期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:
Jiang, Lin
;
Zhang, Liang
;
Liu, Zhi-Quan
收藏
  |  
浏览/下载:22/0
  |  
提交时间:2021/02/02
Co target assembly
Solder
Residual stress
Simulation
Taguchi method
Optimal design
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