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浏览/检索结果: 共23条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Improving the corrosion resistance of hot-working mold steel against al alloy melt by coating (EI收录) 会议 Chongqing, China, 作者:  Yi, Yao Yong[1];  Luo, Zhe Min[2];  Ngai, Tungwai Leo[2];  Ngai, Sieglind[2];  Li, Lie Jun[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Alloy steel  Aluminum  Aluminum coatings  Aluminum corrosion  Coatings  Corrosion  Corrosion resistance  Die casting  Energy dispersive spectroscopy  Hot working  Ion implantation  Molds  Scanning electron microscopy  Titanium alloys  X ray diffraction   Effect of heat treatment on morphology of Fe-rich intermetallics in Al-Cu alloys (CPCI-S收录) 会议 作者:  Lin, B.[1];  Zhang, W. W.[2] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 Al-Cu alloys  Iron-rich intermetallics  Solid-state phase transformation  Solution heat treatment   FEM and contour method study of quenching residual stress of 7050 aluminum alloy cross-shaped component (EI收录) 会议 Istanbul, Turkey, 作者:  Li, Yang[1,2,3];  Wu, Yunxin[1,2,3];  Gong, Hai[1,2,3];  Xiao, Feng[1,2,3] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Aluminum  Aluminum alloys  Deformation  Elastoplasticity  Heat transfer  Manufacture  Quenching  Residual stresses  Stress concentration  Stresses   Microstructure and mechanical property of Ti3AlC2/TiAl3 composite synthesized by hot pressing (EI收录) 会议 Chengdu, China, 作者:  Chen, Wei Ping[1];  Zeng, Yong[1];  Li, Xiao Mei[1];  Xiao, Hua Qiang[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 Aluminum  Ball milling  Bending strength  Cracks  Failure (mechanical)  Fracture toughness  Hot pressing  Mechanical properties  Milling (machining)  Powders  Scanning electron microscopy  Titanium alloys  Titanium compounds  Vickers hardness  X ray diffraction  X ray powder diffraction   Microstructure and mechanical properties of submerged friction stir processing Mg-Y-Nd alloy (EI收录) 会议 Chengdu, China, 作者:  Cao, Geng Hua[1];  Zhang, Da Tong[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Alloys  Electron microscopy  Friction  Grain boundaries  Grain refinement  Grain size and shape  Mechanical properties  Microstructure  Neodymium alloys  Scanning electron microscopy  Tensile strength  Tensile testing  Transmission electron microscopy  Tribology   Microstructural evolution of a fine-grained Mg-Y-Nd alloy during superplastic deformation (EI收录) 会议 Guiyang, China, 作者:  Cao, Genghua[1];  Zhang, Datong[1] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/11 Electron microscopy  Friction  Friction stir welding  Grain boundaries  Grain boundary sliding  Grain growth  High resolution transmission electron microscopy  Microstructure  Neodymium alloys  Scanning electron microscopy  Superplastic deformation  Superplasticity  Transmission electron microscopy   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Reduction of leakage current in GaN-based high-electron mobility transistor employing carbon-doped GaN superlattice buffer layers (EI收录) 会议 Beijing, China, 作者:  Xu, Mingsheng[1];  Weng, Yuanhang[1];  Wang, Hong[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Buffer layers  Electron mobility  Electronic properties  Energy gap  Gallium alloys  Gallium nitride  Leakage currents  Optical waveguides  Transistors  Wide band gap semiconductors   Microstructure and mechanical properties of a fine-grained AZ91 magnesium alloy prepared by multi-pass friction stir processing (EI收录) 会议 Guiyang, China, 作者:  Lu, Zhilong[1];  Zhang, Datong[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Characterization  Friction  Grain refinement  Grain size and shape  Magnesium  Magnesium alloys  Mechanical properties  Microstructure  Tensile strength  Tribology   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry