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CORC

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Scheduling a Single-Arm Multi-Cluster Tool With a Condition-Based Cleaning Operation 期刊论文
IEEE/CAA Journal of Automatica Sinica, 2023, 卷号: 10, 期号: 10, 页码: 1965-1983
作者:  Qinghua Zhu;  Hongpeng Li;  Cong Wang;  Yan Hou
收藏  |  浏览/下载：4/0  |  提交时间：2023/09/07
Scheduling Dual-Arm Multi-Cluster Tools With Regulation of Post-Processing Time 期刊论文
IEEE/CAA Journal of Automatica Sinica, 2023, 卷号: 10, 期号: 8, 页码: 1730-1742
作者:  Qinghua Zhu;  Bin Li;  Yan Hou;  Hongpeng Li;  Naiqi Wu
收藏  |  浏览/下载：12/0  |  提交时间：2023/07/20
High-Performance Planar-Type Photodetector Based on Hot-PressedCsPbBr(3) Wafer br 期刊论文
JOURNAL OF PHYSICAL CHEMISTRY LETTERS, 2022, 卷号: 13
作者:  Zhao, Xiao;  Wang, Shimao;  Zhuge, Fuwei;  Song, Yanan;  Aoki, Toru
收藏  |  浏览/下载：9/0  |  提交时间：2022/12/23
Wave mixing efficiency in InAs/GaAs semiconductor quantum dot optical amplifiers and lasers 期刊论文
Laser Physics Letters, 2022, 卷号: 19, 期号: 11, 页码: 6
作者:  T. Renaud;  H. M. Huang;  F. Grillot and D. Bimberg
收藏  |  浏览/下载：1/0  |  提交时间：2023/06/14
Solution-processable hierarchical-porous vanadium nitride films on silicon substrates for highly efficient symmetric supercapacitors 期刊论文
JOURNAL OF POWER SOURCES, 2021, 卷号: 507
作者:  Wu, Z. Q.;  Yang, B. B.;  Li, H.;  Tong, H. Y.;  Wang, X.
收藏  |  浏览/下载：31/0  |  提交时间：2021/09/06
Silicon recycling and iron, nickel removal from diamond wire saw silicon powder waste: Synergistic chlorination with CaO smelting treatment 期刊论文
MINERALS ENGINEERING, 2021, 卷号: 169, 页码: 13
作者:  Yang, Shicong;  Wan, Xiaohan;  Wei, Kuixian;  Ma, Wenhui;  Wang, Zhi
收藏  |  浏览/下载：37/0  |  提交时间：2021/08/31
Preparation and Tribological Properties of Graphene Oxide/Polydopamine-Derived Carbon Films on Silicon Substrate 期刊论文
Journal of Materials Engineering and Performance, 2021, 卷号: 30, 期号: 4, 页码: 2462-2472
作者:  Zang, Chao;  Yang, Ming;  Jia, Zhengfeng;  Zhang, Jing;  Jiang, Jinlong
收藏  |  浏览/下载：7/0  |  提交时间：2021/06/03
Automated Silicon-Substrate Ultra-Microtome for Automating the Collection of Brain Sections in Array Tomography 期刊论文
IEEE-CAA JOURNAL OF AUTOMATICA SINICA, 2021, 卷号: 8, 期号: 2, 页码: 389-401
作者:  Cheng, Long;  Liu, Weizhou;  Zhou, Chao;  Zou, Yongxiang;  Hou, Zeng-Guang
收藏  |  浏览/下载：20/0  |  提交时间：2021/03/08
Impact of TID on Within-Wafer Variability of Radiation-Hardened SOI Wafers 期刊论文
IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2021, 卷号: 68, 期号: 7, 页码: 1423-1429
作者:  Zheng, QW (Zheng, Qiwen) 1;  Cui, JW (Cui, Jiangwei) 1;  Yu, XF (Yu, Xuefeng) 1;  Li, YD (Li, Yudong) 1;  Lu, W (Lu, Wu) 1
收藏  |  浏览/下载：39/0  |  提交时间：2021/08/06
Lattice Defects and Exfoliation Efficiency of 6H-SiC via H-2(+) Implantation at Elevated Temperature 期刊论文
MATERIALS, 2020, 卷号: 13, 期号: 24, 页码: 13
作者:  Wang, Tao;  Yang, Zhen;  Li, Bingsheng;  Xu, Shuai;  Liao, Qing
收藏  |  浏览/下载：13/0  |  提交时间：2021/12/13

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