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浏览/检索结果: 共4条，第1-4条 帮助 限定条件 发表日期：2020    内容类型：期刊论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Self-assembled three-dimensional structure with optimal ratio of GO and SiC particles effectively improving the thermal conductivity and reliability of epoxy composites 期刊论文 COMPOSITES COMMUNICATIONS, 2020, 卷号: 22 作者:  He, Jing;  Wang, Hua;  Qu, Qiqi;  Su, Zheng;  Qin, Tengfei 收藏  |  浏览/下载：23/0  |  提交时间：2021/03/15 GO-SiC structure  Epoxy resin  Thermal conductivity  Reliability   Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint 期刊论文 Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81 作者:  Liu, Yun;  Yu, Weiyuan;  Sun, Xuemin;  Wang, Fengfeng 收藏  |  浏览/下载：10/0  |  提交时间：2022/02/17 Binary alloys  Dissolution  Electronics packaging  Energy dispersive spectroscopy  Intermetallics  Lead-free solders  Morphology  Needles  Scanning electron microscopy  Shear flow  Soldered joints  Soldering  Tin  Tin alloys  Tin metallography  Ultrasonic effects  Ultrasonic waves  Uranium metallography  Vanadium metallography  Design/methodology/approach  Dispersion strengthening  Energy dispersive X ray spectroscopy  Fractured surfaces  Grain morphologies  Grooves  Ultrasonic cavitation  Ultrasonic vibration   Performance evaluation and prediction of the integrated circuit industry in China: A hybrid method 期刊论文 SOCIO-ECONOMIC PLANNING SCIENCES, 2020, 卷号: 69, 页码: 12 作者:  Zhou, Xiaoyang;  Chen, Hao;  Chai, Jian;  Wang, Shouyang;  Lev, Benjamin 收藏  |  浏览/下载：23/0  |  提交时间：2020/05/24 Dynamic DEA  Projection analysis  Grey model  Integrated circuit industry   Evolution of the mechanical properties of a cobalt-based alloy under thermal shocks 期刊论文 Materials and Design, 2020, 卷号: 188 作者:  Wen, Junxia;  Che, Hongyan;  Cao, Rui;  Dong, Hao;  Ye, Youxiong 收藏  |  浏览/下载：18/0  |  提交时间：2020/11/14 Carbides  Electronics packaging  Hot isostatic pressing  Mechanical properties  Microstructural evolution  Nanoindentation  Scanning electron microscopy  Sintering  Thermal fatigue  Thermal shock  Carbide particles  Cobalt base alloys  Cobalt based alloy  Energy dispersion spectrum  High stress concentration  Nanoindentation tests  Reduced modulus  Thermal fatigue cracks