CORC

在结果中检索

CORC

浏览/检索结果: 共70条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Design and analysis of bonding process of the space-based rectangular curved prisms 会议论文
Shanghai, China, 2021-10-28
作者:  Jia, Xinyin;  Wang, Feicheng;  Ke, Shanliang;  Hu, Bingliang;  Li, Libo
收藏  |  浏览/下载：41/0  |  提交时间：2022/03/18
Study on the effect of post curing on the mode II fracture energy of structural adhesive using a parameter identification approach 期刊论文
International Journal of Adhesion and Adhesives, 2019, 卷号: 95
作者:  Han, Xiao;  Chao, Yuexing;  Zhang, Wei;  Chao, Yuezhen;  Wu, Chengwei
收藏  |  浏览/下载：17/0  |  提交时间：2019/12/02
On the fracture behaviour of adhesively bonded CFRP hat-shaped thin-walled beam under axial crushing load: An experimental and modelling study 期刊论文
COMPOSITE STRUCTURES, 2019, 卷号: 215, 页码: 258-265
作者:  Han, Xiao;  Hou, Shaoqiang;  Ying, Liang;  Hou, Wenbin;  Aliyev, Husniddin
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/02
On the fracture behaviour of adhesively bonded CFRP hat-shaped thin-walled beam under axial crushing load: An experimental and modelling study 期刊论文
Composite Structures, 2019
作者:  Xiao Han;  Shaoqiang Hou;  Liang Ying;  Wenbin Hou;  Husniddin Aliyev
收藏  |  浏览/下载：12/0  |  提交时间：2019/12/13
Optimization on benzocyclobutene-based CMUT fabrication with an inverse structure 期刊论文
SENSORS AND ACTUATORS A-PHYSICAL, 2018, 卷号: 281, 页码: 1-8
作者:  Li, Zhenhao;  Na, Shuai;  Chen, Albert I. H.;  Wong, Lawrence L. P.;  Sun, Zhendong
收藏  |  浏览/下载：31/0  |  提交时间：2018/11/16
Large Area, Highly Transparent, and Mechanically Stable Adhesive Films with Tunable Refractive Indices 期刊论文
MACROMOLECULAR CHEMISTRY AND PHYSICS, 2018, 卷号: 219, 期号: 8
作者:  Wang, Dan;  Zhang, Jianfu;  He, Yuanyuan;  Li, Wenfei;  Li, Shitao
收藏  |  浏览/下载：26/0  |  提交时间：2019/04/09
Experimental Studies on Strengthening and Failure Mechanism for the Metal/Silicone Rubber/ Metal Bonding System 期刊论文
INTERNATIONAL JOURNAL OF APPLIED MECHANICS, 2018, 卷号: 10, 期号: 3
作者:  Li JC(李景传);  Liang LH(梁立红);  Liu XM(刘小明);  Ma HS(马寒松);  Song JR(宋晶如)
收藏  |  浏览/下载：51/0  |  提交时间：2018/07/17
Ultrasonic vibration-strengthened adhesive bonding of CFRP-to-aluminum joints 期刊论文
Journal of Materials Processing Technology, 2018, 卷号: 257, 页码: 213-226
作者:  Wang, Hui*;  Hao, Xufei;  Yan, Kui;  Zhou, Huamin;  Hua, Lin
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/04
Process development and reliability for wafer-level 3D IC integration using micro- bump/adhesive hybrid bonding and via-last TSVs 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Yao, Mingjun;  Zhao, Ning;  Yu, Daquan;  Xiao, Zhiyi;  Ma, Haitao
收藏  |  浏览/下载：10/0  |  提交时间：2019/12/02
Study of Three-Dimensional Small Chip Stacking Using Low Cost Wafer-Level Micro-bump/B-Stage Adhesive Film Hybrid Bonding and Via-Last TSVs 期刊论文
JOURNAL OF ELECTRONIC MATERIALS, 2018, 卷号: 47, 页码: 7544-7557
作者:  Yao, Mingjun;  Zhao, Ning;  Wang, Teng;  Yu, Daquan;  Xiao, Zhiyi
收藏  |  浏览/下载：16/0  |  提交时间：2019/12/02

©版权所有 ©2017 CSpace - Powered by CSpace