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Reliability issues of lead-free solder joints in electronic devices 期刊论文
SCIENCE AND TECHNOLOGY OF ADVANCED MATERIALS, 2019, 卷号: 20, 期号: 1, 页码: 876-901
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-Quan;  Sun, Lei;  Long, Wei-Min
收藏  |  浏览/下载：77/0  |  提交时间：2021/02/02
The Influence of Infilling Conditions on Flaw Surface Relative Displacement Induced Cracking Behavior in Hard Rock 期刊论文
ROCK MECHANICS AND ROCK ENGINEERING, 2019, 期号: -, 页码: 22
作者:  Pan, Peng-Zhi;  Miao, Shuting;  Jiang, Quan;  Wu, Zhenhua;  Shao, Changyue
收藏  |  浏览/下载：12/0  |  提交时间：2021/05/25
Four new sesquiterpene derivatives from Dendrobium findlayanum 期刊论文
CHINESE JOURNAL OF NATURAL MEDICINES, 2019, 卷号: 17, 期号: 12, 页码: 900-905
作者:  Yang Dan;  Cheng Zhong-Quan;  Zi Cheng-Ting;  Yang Liu;  Dong Fa-Wu
收藏  |  浏览/下载：25/0  |  提交时间：2020/03/18
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
收藏  |  浏览/下载：21/0  |  提交时间：2021/02/02
Optimal Design of Co/In/Cu Sputtering Target Assembly Using Finite Element Method and Taguchi Method 期刊论文
ACTA METALLURGICA SINICA-ENGLISH LETTERS, 2019, 卷号: 32, 期号: 11, 页码: 1407-1414
作者:  Jiang, Lin;  Zhang, Liang;  Liu, Zhi-Quan
收藏  |  浏览/下载：11/0  |  提交时间：2021/02/02
Unique N-glycosylation of a recombinant exo-inulinase from Kluyveromyces cicerisporus and its effect on enzymatic activity and thermostability 期刊论文
Journal of Biological Engineering, 2019, 卷号: 13, 期号: 1
作者:  Ma,Junyan;  Li,Qian;  Tan,Haidong;  Jiang,Hao;  Li,Kuikui
收藏  |  浏览/下载：276/0  |  提交时间：2019/12/02
Influences of doping Ti nanoparticles on microstructure and properties of Sn58Bi solder 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 19, 页码: 17583-17590
作者:  Jiang, Nan;  Zhang, Liang;  Liu, Zhi-quan;  Sun, Lei;  Xiong, Ming-yue
收藏  |  浏览/下载：13/0  |  提交时间：2021/02/02
GRID: a student project to monitor the transient gamma-ray sky in the multi-messenger astronomy era 期刊论文
EXPERIMENTAL ASTRONOMY, 2019, 卷号: 48, 期号: 1, 页码: 77-95
作者:  Wen, Jiaxing;  Long, Xiangyun;  Zheng, Xutao;  An, Yu;  Cai, Zhengyang
收藏  |  浏览/下载：298/0  |  提交时间：2019/10/21
Microstructures and properties of SnAgCu lead-free solders bearing CuZnAl particles 期刊论文
JOURNAL OF MATERIALS SCIENCE-MATERIALS IN ELECTRONICS, 2019, 卷号: 30, 期号: 16, 页码: 15054-15063
作者:  Zhao, Meng;  Zhang, Liang;  Liu, Zhi-quan;  Xiong, Ming-yue;  Sun, Lei
收藏  |  浏览/下载：19/0  |  提交时间：2021/02/02

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