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浏览/检索结果: 共17条，第1-10条 帮助 限定条件 专题：华南理工大学    第一署名单位    第一作者单位    通讯作者单位     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 High-luminous efficacy white light-emitting diodes with thin-film flip-chip technology and surface roughening scheme (EI收录) 期刊论文 Journal of Physics D: Applied Physics, 2016, 卷号: 49 作者:  Hu, Xiao-Long[1,2];  Zhang, Jing[1,2];  Wang, Hong[1,2];  Zhang, Xi-Chun[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Diodes  Efficiency  Etching  Flip chip devices  Gallium nitride  Inductively coupled plasma  Light emission  Lighting  Phosphors  Silicones  Thin films   Performance of InGaN-based thin-film LEDs with flip-chip configuration and concavely patterned surface fabricated on electroplating metallic substrate (EI收录) 期刊论文 IEEE Photonics Journal, 2016, 卷号: 8 作者:  Hu, Xiao-Long[1];  Qi, Zhao-Yi[1];  Wang, Hong[1];  Zhang, Xi-Chun[1] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/24 Electrodes  Electroplating  Fabrication  Flip chip devices  Gallium nitride  Light emitting diodes  Sapphire  Substrates   Premelting behavior and interfacial reaction of the Sn/Cu and Sn/Ag soldering systems during the reflow process (EI收录) 期刊论文 Journal of Materials Science: Materials in Electronics, 2012, 卷号: 23, 页码: 1543-1551 作者:  Zhou, M.B.[1];  Ma, X.[1];  Zhang, X.P.[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26 Differential scanning calorimetry  Flip chip devices  Interface states  Intermetallics  Liquids  Phase interfaces  Soldering alloys  Tin   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Reliability analysis and case studies on FCBGA packaged devices (EI收录) 会议 Changsha, China, 作者:  Lin, Xiao-Ling[1];  Xie, Shao-Feng[1];  Yao, Ruo-He[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Chip scale packages  Cracks  Electronics packaging  Failure (mechanical)  Failure analysis  Field programmable gate arrays (FPGA)  Flip chip devices  Integrated circuit interconnects  Packaging  Reconfigurable hardware  Reliability  Soldered joints  Soldering  Soldering alloys  Thermal stress   Reliability Analysis and Case Studies on FCBGA Packaged Devices (CPCI-S收录) 会议 作者:  Lin, Xiao-ling[1];  Xie, Shao-feng[1];  Yao, Ruo-he[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Flip chip plastic ball grid array (FC-PBGA)  thermal stress  reflowing  reliability analysis   A study of flip-chip direct attachment LED COBs with metal core print circuit boards (EI收录) 会议论文 2013 10th China International Forum on Solid State Lighting, ChinaSSL 2013, Beijing, China, November 10, 2013 - November 12, 2013 作者:  Li, Cheng[1];  Li, Honghao[1];  Li, Zongtao[1,2];  Ding, Xinrui[1,2];  Guan, Wohuan[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 Flip chip devices  Leakage currents  Lighting  Reconfigurable hardware  Stresses   Phase field simulation of solidification behavior and microstructure evolution of Sn-58Bi/Cu solder interconnect during reflow soldering proc (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Ma, Wen-Jing[1];  Ke, Chang-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Anisotropy  Electronics packaging  Flip chip devices  Microstructure  Morphology  Soldering  Soldering alloys  Solidification  Undercooling   Size effect on the intermetallic compound coalescence in Sn-Ag-Cu solder and Sn-Ag-Cu/Cu solder joints (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Min-Bo, Zhou[1];  Xiao, Ma[1];  Xin-Ping, Zhang[1,2] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/15 Coalescence  Differential scanning calorimetry  Electronics packaging  Flip chip devices  Intermetallics  Packaging  Silver  Soldering  Soldering alloys  Solidification  Spheres  Undercooling   Ductile-to-brittle transition of flip-chip solder joints influenced by electromigration (EI收录) 会议论文 Proceedings - 2010 11th International Conference on Electronic Packaging Technology and High Density Packaging, ICEPT-HDP 2010, Xi'an, China, August 16, 2010 - August 19, 2010 作者:  Lu, Yu-Dong[1,2];  En, Yun-Fei[1,2];  He, Xiao-Qi[1,2];  Niu, Gang[3];  Pecht, Michael[3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/16 Aluminum  Chip scale packages  Ductile fracture  Ductility  Electromigration  Flip chip devices  Intermetallics  Mechanical properties  Packaging  Vacancies