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科研机构
兰州理工大学 [45]
内容类型
期刊论文 [44]
会议论文 [1]
发表日期
2022 [1]
2021 [1]
2020 [9]
2019 [13]
2018 [3]
2016 [3]
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专题:兰州理工大学
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Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP
期刊论文
Microelectronics Reliability, 2022, 卷号: 135
作者:
Yu, Weiyuan
;
Li, Binbin
;
Wu, Baolei
;
Wang, Fengfeng
;
Wang, Mingkang
收藏
  |  
浏览/下载:18/0
  |  
提交时间:2022/08/09
Binary alloys
Copper
Copper alloys
Indium alloys
Lead-free solders
Microstructure
Shear flow
Silicon carbide
Soldering
Temperature
Thermoelectric equipment
Wide band gap semiconductors
Composite solders
Electronics devices
In-45cu composite solder paste
Intermetallics compounds
Microstructures and mechanical properties
Service temperature
Shears strength
Solderpaste
Ultrasonic action time
Ultrasonic-assisted TLP
Effect of Ultrasonic Vibration on Microstructure and Mechanical Properties of Welding-brazing Joint Between Aluminum and Copper by Plasma Welding
期刊论文
Cailiao Daobao/Materials Reports, 2021, 卷号: 35, 期号: 16, 页码: 16115-16119
作者:
Fan, Ding
;
Li, Yongpeng
;
Wu, Lijian
;
Huang, Jiankang
;
Liu, Shien
收藏
  |  
浏览/下载:28/0
  |  
提交时间:2022/02/17
Aluminum
Aluminum alloys
Aluminum plating
Binary alloys
Copper alloys
Eutectics
Grain size and shape
Intermetallics
Plates (structural components)
Shearing
Tensile testing
Ultrasonic waves
Vibrations (mechanical)
Welds
Al-Cu eutectic
Aluminium plates
Brazing joints
Grainsize
Intermetallic compound layer
Intermetallics compounds
Microstructures and mechanical properties
Red coppers
Shearing strength
Ultrasonic-vibration
Effects of SnO2 Nanoparticles on Microstructure and Intermetallic Compounds of Sn0.6Cu Solder
期刊论文
Xiyou Jinshu Cailiao Yu Gongcheng/Rare Metal Materials and Engineering, 2020, 卷号: 49, 期号: 12, 页码: 4297-4302
作者:
Yu, Weiyuan
;
Sun, Jungang
;
Liu, Yun
;
B., Wu
;
Z., Lei
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Binary alloys
Brazing
Brazing filler metals
Grain size and shape
Intermetallics
Melting point
Microstructure
Nanoparticles
Synthesis (chemical)
Brazing joints
Composite solders
Crystal planes
Driving forces
Interfacial intermetallics
Liquidus temperature
Melting process
Melting properties
Effect of Ultrasonic Vibration on Wetting of Water/E-GaInon Different Substrate Surfaces
期刊论文
Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics, 2020, 卷号: 41, 期号: 5, 页码: 1186-1191
作者:
Yu, Wei-Yuan
;
Xing, Chun-Xiao
;
Lin, Qiao-Li
收藏
  |  
浏览/下载:15/0
  |  
提交时间:2022/02/17
Contact angle
Liquids
Momentum transfer
Phase interfaces
Ultrasonic effects
Ultrasonic waves
Different substrates
Liquid-vapor interface
Non-wetting system
Physical factors
Solid/liquid interfaces
Transfer interface
Ultrasonic vibration
Wetting and spreading
Effect of Ultrasonic Vibration on Wetting of Water/E-GaInon Different Substrate Surfaces
期刊论文
Kung Cheng Je Wu Li Hsueh Pao/Journal of Engineering Thermophysics, 2020, 卷号: 41, 期号: 5, 页码: 1186-1191
作者:
Yu, Wei-Yuan
;
Xing, Chun-Xiao
;
Lin, Qiao-Li
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2020/11/14
Contact angle
Liquids
Momentum transfer
Phase interfaces
Ultrasonic effects
Ultrasonic waves
Different substrates
Liquid-vapor interface
Non-wetting system
Physical factors
Solid/liquid interfaces
Transfer interface
Ultrasonic vibration
Wetting and spreading
Evolution of microstructure and phase composition of joints with ultrasonic-assisted resistance brazing
期刊论文
SCIENCE AND TECHNOLOGY OF WELDING AND JOINING, 2020, 卷号: 25, 期号: 6, 页码: 476-482
作者:
Wu, Weijie
;
Yu, Weiyuan
;
Sun, Xuemin
;
Wu, Baolei
;
Wang, Yanhong
收藏
  |  
浏览/下载:7/0
  |  
提交时间:2020/06/02
Aluminium alloy
ultrasonic vibration
grain refinement
eutectoid alpha-Al
phase composition
microstructure evolution
Effect of ultrasonic vibration on interfacial reaction of Ni/Sn/Ni soldered joint
期刊论文
Soldering and Surface Mount Technology, 2020, 卷号: 32, 期号: 2, 页码: 73-81
作者:
Liu, Yun
;
Yu, Weiyuan
;
Sun, Xuemin
;
Wang, Fengfeng
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2022/02/17
Binary alloys
Dissolution
Electronics packaging
Energy dispersive spectroscopy
Intermetallics
Lead-free solders
Morphology
Needles
Scanning electron microscopy
Shear flow
Soldered joints
Soldering
Tin
Tin alloys
Tin metallography
Ultrasonic effects
Ultrasonic waves
Uranium metallography
Vanadium metallography
Design/methodology/approach
Dispersion strengthening
Energy dispersive X ray spectroscopy
Fractured surfaces
Grain morphologies
Grooves
Ultrasonic cavitation
Ultrasonic vibration
Wetting behavior of Fe/Sn system under ultrasonic
期刊论文
Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 2, 页码: 12-17
作者:
Yu, Weiyuan
;
Wu, Baolei
;
Sun, Xuemin
;
Lei, Zhen
;
Sun, Jungang
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Brazing
Brazing filler metals
Fillers
Iron
Morphology
Shotcreting
Ultrasonic testing
Iron substrates
Micromorphologies
Propagation characteristics
Solid/liquid interfaces
Ultrasonic power
Ultrasonic treatments
Wetting balance
Wetting behavior
Wetting behavior of Fe/Sn system under ultrasonic
期刊论文
Hanjie Xuebao/Transactions of the China Welding Institution, 2020, 卷号: 41, 期号: 2, 页码: 12-17
作者:
Yu, Weiyuan
;
Wu, Baolei
;
Sun, Xuemin
;
Lei, Zhen
;
Sun, Jungang
收藏
  |  
浏览/下载:9/0
  |  
提交时间:2022/02/17
Brazing
Brazing filler metals
Fillers
Iron
Morphology
Shotcreting
Ultrasonic testing
Iron substrates
Micromorphologies
Propagation characteristics
Solid/liquid interfaces
Ultrasonic power
Ultrasonic treatments
Wetting balance
Wetting behavior
Kinetics of dissolution of copper in liquid tin with ultrasonic waves
期刊论文
Materials Research, 2020, 卷号: 23, 期号: 1
作者:
Sun, Xuemin
;
Yu, Weiyuan
;
Wu, Baolei
;
Yang, Guoqing
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2020/11/14
Activation energy
Copper
Electronics packaging
Liquids
Tin
Ultrasonic waves
Dissolution behavior
Dissolution rates
Electronic Packaging
IMC layer
Immersion method
Immersion time
Ultrasonic power
Welding method
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