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科研机构
北京大学 [13]
内容类型
期刊论文 [11]
会议论文 [1]
其他 [1]
发表日期
2016 [2]
2015 [1]
2014 [2]
2013 [2]
2012 [2]
2011 [1]
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专题:北京大学
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Substrate effect modulates adhesion and proliferation of fibroblast on graphene layer
期刊论文
COLLOIDS AND SURFACES B-BIOINTERFACES, 2016
Lin, Feng
;
Du, Feng
;
Huang, Jianyong
;
Chau, Alicia
;
Zhou, Yongsheng
;
Duan, Huiling
;
Wang, Jianxiang
;
Xiong, Chunyang
收藏
  |  
浏览/下载:8/0
  |  
提交时间:2017/12/03
Graphene
Cytocompatibility
Cell function and behavior
Substrate stiffness
Surface wetting property
MESENCHYMAL STEM-CELLS
OSTEOGENIC DIFFERENTIATION
STIFFNESS GRADIENTS
MATRIX-RIGIDITY
FOCAL ADHESION
SOFT
ELASTICITY
FORCE
NUCLEATION
BEHAVIOR
Wettability and spreadability study of molten Sn-3.0Ag-0.5Cu wetting on V-shaped substrate
期刊论文
SOLDERING & SURFACE MOUNT TECHNOLOGY, 2016
Xu, Bingsheng
;
Wu, Yan
;
Zhang, Lina
;
Chen, Junwei
;
Yuan, Zhangfu
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2017/12/04
Surface morphology
Wettability
SAC
Lead-free solder
Surface evolver
V-shaped substrate
DYNAMIC CONTACT-ANGLE
LEAD-FREE SOLDERS
TEMPERATURE-COEFFICIENT
SURFACE-TENSION
NANOSTRUCTURED SURFACES
SIMULATION ANALYSIS
SN-AG
HYSTERESIS
DROPLETS
CU
Simulation Analysis on the Profiles of Droplets Wetting on the Substrates
期刊论文
JOURNAL OF DISPERSION SCIENCE AND TECHNOLOGY, 2015
Xu, Bing-Sheng
;
Chen, Jun-Wei
;
Yuan, Zhang-Fu
;
Zhang, Lina
;
Fang, Yan
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2017/12/03
Curve fitting
molten droplets
physical property
surface characteristic
surface volver simulation
CONTACT-ANGLE HYSTERESIS
TEMPERATURE-COEFFICIENT
SURFACE-TENSION
MOLTEN
SLAG
WETTABILITY
DROPS
Convex Nanobending at a Moving Contact Line: The Missing Mesoscopic Link in Dynamic Wetting
其他
2014-01-01
Chen, Lei
;
Yu, Jiapeng
;
Wang, Hao
收藏
  |  
浏览/下载:6/0
  |  
提交时间:2015/11/10
dynamic wetting
contact line
film profile
AFM
microscopic contact angle
mesoscopic contact angle
bending
ATOMIC-FORCE MICROSCOPY
WATER CONDENSATION
SOLID-SURFACE
NANOSCALE
ANGLE
NANODROPLETS
MECHANISM
LIQUIDS
GROWTH
SHEAR
Simulation analysis on surface morphology and hysteresis characteristics of molten Sn-3.0Ag-0.5Cu sitting on the inclined Ni substrate
期刊论文
colloids and surfaces a physicochemical and engineering aspects, 2014
Xu, Bingsheng
;
Yuan, Zhangfu
;
Wu, Yan
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2015/11/10
Contact angle hysteresis
Spreading behavior
Surface morphology
Profile curve fitting
Surface Evolver simulation
TEMPERATURE-COEFFICIENT
SOLID-SURFACES
CONTACT ANGLES
LIQUID-DROPS
SN-AG
TENSION
PLANE
RETENTION
DROPLETS
SILICON
Interfacial reaction thermodynamics between Sn-Cu-Ag solder and Ni substrate
会议论文
Xu, Hong Yan
;
Wu, Hu
;
Xu, Bing Sheng
;
Wu, Yan
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2015/11/13
Dissolutive wetting process and interfacial characteristic of molten Sn-17Bi-0.5Cu alloy on copper substrate
期刊论文
稀有金属, 2013
Xu, Bing-Sheng
;
Zang, Li-Kun
;
Yuan, Zhang-Fu
;
Wu, Yan
;
Zhou, Zhou
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2015/11/10
Lead-free solder
Reactive wetting
Sessile drop method
Interfaces
SOLDER JOINTS
CU SUBSTRATE
TEMPERATURE-COEFFICIENT
SURFACE-TENSION
SN-BI
WETTABILITY
KINETICS
SILICON
GROWTH
IMC
Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate
期刊论文
科学通报 英文版, 2012
Zang LiKun
;
Yuan ZhangFu
;
Zhan YaPeng
;
Wang ChenYu
;
Xu BingSheng
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2015/11/12
molten metal and alloys
Pb-free solder
sessile drop method
kinetics
electronic materials
SURFACE-TENSION
WETTABILITY
INTERFACE
DYNAMICS
SYSTEMS
AL
Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures
期刊论文
journal of electronic materials, 2012
Zang, Likun
;
Yuan, Zhangfu
;
Cao, Zhanmin
;
Matsuura, Hiroyuki
;
Tsukihashi, Fumitaka
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2015/11/12
Wetting
metals and alloys
melting
interface
electronic materials
LEAD-FREE SOLDERS
BI-SN SYSTEM
SURFACE-TENSION
ALLOYS
AG
EQUILIBRIUM
BEHAVIOR
Influence of substrate stiffness on cell-substrate interfacial adhesion and spreading: A mechano-chemical coupling model
期刊论文
胶体与界面科学杂志, 2011
Huang, Jianyong
;
Peng, Xiaoling
;
Xiong, Chunyang
;
Fang, Jing
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2015/11/11
Cell-substrate interaction
Substrate stiffness
Adhesion strength
Spreading area
Mechano-chemical coupling model
EXTRACELLULAR-MATRIX
INTEGRIN ACTIVATION
TRACTION FORCES
DYNAMICS
MECHANICS
RIGIDITY
CHEMISTRY
SURFACES
KINETICS
CONTACT
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