Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate

doi:10.1007/s11434-011-4918-9

CORC > 北京大学 > 工学院

	Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate
	Zang LiKun ; Yuan ZhangFu ; Zhan YaPeng ; Wang ChenYu ; Xu BingSheng
刊名	科学通报英文版
	2012
关键词	molten metal and alloys Pb-free solder sessile drop method kinetics electronic materials SURFACE-TENSION WETTABILITY INTERFACE DYNAMICS SYSTEMS AL
DOI	10.1007/s11434-011-4918-9
英文摘要	The reactive wetting kinetics of a Sn-30Bi-0.5Cu Pb-free solder alloy on a Cu substrate was investigated by the sessile drop method from 493 to 623 K. The triple line frontier, characterized by the drop base radius R was recorded dynamically with a high resolution CCD using different spreading processes in an Ar-H-2 flow. We found a good agreement with the De Gennes model for the relationship between ln(dR/dt) and lnR for the spreading processes at 493 and 523 K. However, a significant deviation from the De Gennes model was found for the spreading processes at 548 and 623 K. Our experimental results show a complicated temperature effect on the spreading kinetics. Intermetallics at the Sn-30Bi-0.5Cu/Cu interface were identified as Cu6Sn5 adjacent to the solder and Cu3Sn adjacent to the Cu substrate. The intermetallic compounds effectively enhanced the triple line mobility because of reaction product formation at the diffusion frontier.; http://gateway.webofknowledge.com/gateway/Gateway.cgi?GWVersion=2&SrcApp=PARTNER_APP&SrcAuth=LinksAMR&KeyUT=WOS:000299924600017&DestLinkType=FullRecord&DestApp=ALL_WOS&UsrCustomerID=8e1609b174ce4e31116a60747a720701 ; Multidisciplinary Sciences; SCI(E); 1; ARTICLE; 6; 682-686; 57
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/235007]
专题	工学院
推荐引用方式 GB/T 7714	Zang LiKun,Yuan ZhangFu,Zhan YaPeng,et al. Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate[J]. 科学通报英文版,2012.
APA	Zang LiKun,Yuan ZhangFu,Zhan YaPeng,Wang ChenYu,&Xu BingSheng.(2012).Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate.科学通报英文版.
MLA	Zang LiKun,et al."Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate".科学通报英文版 (2012).