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浏览/检索结果: 共16条，第1-10条 帮助 限定条件 内容类型：会议论文     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Bulk Growth and properties of Lead Free Hybrid Tin Perovskite Single Crystals 会议论文 第三届新型太阳能电池学术研讨会 作者:  Yangyang Dang;  Dianxing Ju;  Guodong Zhang;  Xutang Tao 收藏  |  浏览/下载：1/0  |  提交时间：2019/12/31 Hybrid Perovskite  Crystal Growth  Band Gap  Stability   掺杂有机染料的PTFP闪烁玻璃在伽马激发下的发光 会议论文 全国第六届核仪器及其应用学术会议论文集, Proceedings of the 6th National Conference on Nuclear Instrument & Its Application, 全国第六届核仪器及其应用学术会议, The 6th National Conference on Nuclear Instrument & Its Application, 中国广西桂林, CNKI, 中国核学会核电子学与核探测技术分会、中国电子学会核电子学与核探测技术分会 夏良斌; 欧阳晓平; 王群书; 康克军; 何小玲; 顾牡; Xia Liangbin; Ouyang Xiaoping; Wang Qunshu; Kang Kejun; He Xiaoling; Gu Mu 收藏  |  浏览/下载：6/0 Lead-Tin Plating Split Loop Resonators 会议论文 Strandhotel, 2003 作者:  N.R.Lobanov;  D.C.Weisser 收藏  |  浏览/下载：4/0  |  提交时间：2017/06/16 Thermal fatigue and creep fracture behaviors of a nanocomposite solder in microelectronic/optoelectronic packaging (CPCI-S收录) 会议论文 FRACTURE OF MATERIALS: MOVING FORWARDS 作者:  Zhang, X. P.;  Lim, C. S. H.;  Mai, Y. W.;  Shi, Y. W. 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 thermal fatigue  creep resistance  nano-composite solder  tin-lead solder  fracture   Creep fracture behaviour of joints soldered by a nano-composite solder, lead-free and conventional tin-lead solders (EI收录) 会议论文 11th International Conference on Fracture 2005, ICF11, Turin, Italy, March 20, 2005 - March 25, 2005 作者:  Zhang, X.P.[1,2];  Shi, Y.W.[3];  Mai, Y.W.[1];  Shrestha, S.[4];  Dorn, L.[4] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/18 Creep  Creep resistance  Fractography  Fracture  Fracture mechanics  Lead  Microelectronics  Nanocomposites  Particle reinforced composites  Silver  Silver alloys  Soldering alloys  Textures   Processing treatment of a lead-free Sn-Ag-Cu-Bi solder by rapid laser-beam reflowing and the creep property of its soldered connection (EI收录) 会议论文 Journal of Materials Processing Technology, Singapore, Singapore, December 4, 2006 - December 6, 2006 作者:  Zhang, X.P.[1];  Yu, C.B.[1];  Zhang, Y.P.[1];  Shrestha, S.[2];  Dorn, L.[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/17 Creep  Laser beams  Lead  Silver  Soldering alloys  Tin alloys   Effect of dopant on microstructure and mechanical properties of Pb-free solder joints (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Shanghai, China, August 14, 2007 - August 17, 2007 作者:  Li, G.Y.[1] 收藏  |  浏览/下载：17/0  |  提交时间：2019/04/17 Activation energy  Alloys  Brazing  Copper  Copper alloys  Electronics packaging  Lead  Mechanical properties  Semiconducting intermetallics  Silver  Silver alloys  Soldering alloys  Technology  Tin alloys  Welding   Effect of nano-dopant on intermetallic compounds growth in Sn-3.0Ag-0.5Cu-xBi solder joints during aging process (EI收录) 会议论文 Proceedings of the Electronic Packaging Technology Conference, EPTC, Chengdu, China, August 12, 2014 - August 15, 2014 作者:  Tang, Y.[1,2];  Zhou, B.[3];  Huang, J.H.[1];  Wu, Z.Z.[1];  Li, G.Y.[1] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/12 Bismuth compounds  Copper compounds  Electronics packaging  Grain boundaries  Intermetallics  Lead  free solders  Microstructural evolution  Scanning electron microscopy  Silver  Soldered joints  Tin   Effects of Pb content on solidification behavior and microstructure on mixed solder alloy (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Wei, Xiongfeng[1,2];  Li, Xunping[2];  Zhoubin[2];  Wei, Guoqiang[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/15 Alloys  Electronics packaging  Eutectics  Lead  Microstructural evolution  Microstructure  Phase diagrams  Silver  Silver alloys  Soldering  Soldering alloys  Solidification  Tin alloys   Investigation on microstructures and properties of low Ag content lead-free solder alloy (EI收录) 会议论文 ICEPT-HDP 2011 Proceedings - 2011 International Conference on Electronic Packaging Technology and High Density Packaging, Shanghai, China, August 8, 2011 - August 11, 2011 作者:  Wei, Guoqiang[1];  Wan, Zhonghua[1];  Xue, Mingyang[1];  Wang, Lei[1] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/15 Alloys  Cerium alloys  Dissolution  Electronics packaging  Eutectics  Microstructure  Packaging  Tin  Wetting