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浏览/检索结果: 共7条，第1-7条 帮助 已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Methanolysis of ammonia borane by shape-controlled mesoporous copper nanostructures for hydrogen generation 期刊论文 2015, 卷号: 44, 页码: 1070-1076 作者:  Yao, Qilu[1];  Huang, Ming[2];  Lu, Zhang-Hui[1];  Yang, Yuwen[1];  Zhang, Yuxin[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/11/30 Experimental and phenomenological investigations of diffusion in Co-Al-W alloys 期刊论文 SCRIPTA MATERIALIA, 2015, 卷号: 106, 页码: 13-16 作者:  Chang, Hui[1];  Xu, Guanglong[2];  Lu, Xiao-Gang[3];  Zhou, Lian[4];  Ishida, Kiyohito[5] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/26 Co-Al-W  Bulk diffusion  Electron probe microanalysis (EPMA)  Modelling  Phenomenological treatment   Finite element simulation of the size effect on thermal fatigue behavior of solder bump joints in TSV structure (CPCI-S收录) 会议 作者:  Jiang, Han[1];  Liang, Shui-Bao[1];  Yuwen, Hui-Hui[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 TSV  solder bump joint  thermal fatigue  size effect  finite element analysis   Numerical simulation of the TSV-Cu filling by electroplating process with the accelerator and suppressor (CPCI-S收录) 会议 作者:  Yuwen, Hui-Hui[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 TSV  Cu electroplating  finite element simulation  surface coverage  local current density distribution   The interfacial thermo-mechanical reliability of 3D memory-chip stacking with through silicon via array (CPCI-S收录) 会议 作者:  Yuwen, Hui-Hui[1];  Qin, Hong-Bo[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 TSV  Cu-Cu interconnect  thermo-mechanical reliability  keep-away-zone  finite element method   Influence of geometry of microbump interconnects on thermal stress and fatigue life of interconnects in copper filled through silicon via str (EI收录) 会议论文 Proceedings - 2013 14th International Conference on Electronic Packaging Technology, ICEPT 2013, Dalian, China, August 11, 2013 - August 14, 2013 作者:  Qin, Hong-Bo[1];  Yuwen, Hui-Hui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/15 Electronics packaging  Finite element method  Thermal cycling  Thermal stress  Three dimensional   Influence of Geometry of Microbump Interconnects on Thermal Stress and Fatigue Life of Interconnects in Copper Filled Through Silicon Via Str (CPCI-S收录) 会议论文 2013 14TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT) 作者:  Qin, Hong-Bo[1];  Yuwen, Hui-Hui[1];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/15 TSV  3D packaging  microbump interconnect  fatigue life  finite element simulation