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浏览/检索结果: 共13条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 The Challenges and Coping Strategies of Teachers' Professional Development under the MOOC Era 会议 作者:  Zhou, Jixiang[1];  Liu, Jia[1];  Shu, Changhe[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 MOOC  Professional development of teachers  Teaching ability  Coping strategy   The Application and Prognostic Evaluation of STEMI Clinical Pathway in the Treatment of EPCI Patients (CPCI-S收录) 会议 作者:  Zhou, Yijun[1];  Ye, Zi[1];  Yan, Xiong[1];  Guang, Kaipang[1];  Peng, Jiang[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Finite element analysis on shear lag effect of concrete curved box girder under moving loads (CPCI-S收录) 会议 作者:  Lu, Hai-lin[1];  Wan, Chong-yong[1];  Zhou, Xiao-long[1];  Qian, Jia-qi[1];  Chen, Bin[2] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 moving load  concrete  finite element  curved box birder  shear lag effect   Levels and distributions of polybrominated diphenyl ethers, hexabromocyclododecane, and tetrabromobisphenol A in sediments from Taihu Lake, C (CPCI-S收录) 会议 作者:  Wang, Jingzhi[1,2];  Jia, Xuwei[1];  Gao, Shutao[1];  Zeng, Xiangying[1];  Li, Huiru[1] 收藏  |  浏览/下载：9/0  |  提交时间：2019/04/11 Polybrominated diphenyl ethers  Hexabromocyclododecane  Tetrabromobisphenol A  Sediment  Taihu Lake   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Silk Modified Porous PLGA Microspheres for Cell Culture in Vitro (CPCI-S收录) 会议 作者:  Liu, D.[1];  Wu, H.[1];  Jia, Z.[1];  Zhang, X.[1];  Zhou, Z.[2,3] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Multilayer PV-storage Microgrids Algorithm for the Dispatch of Distributed Network (EI收录) 会议 Melbourne, VIC, Australia, 作者:  Yang, Ping[1];  Zhang, Yu-Jia[1];  Xu, Zhi-Rong[1];  Yin, Xu[1];  Zhou, Shao-Xiong[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Algorithms  Heuristic algorithms  Multilayers