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华南理工大学 [13]
内容类型
会议 [13]
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Construction of Structured Low Density Lattice Codes Based on Finite Fields (CPCI-S收录)
会议
作者:
Li, Jia-Yun[1]
;
Xia, Shu-Tao[1]
;
Liu, Xin-Ji[1]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
lead-free solder joint
interfacial reaction
microstructure
BGA
differential scanning calorimetry
Integrated Circuit Fault Prognostics Based on the Delay Characteristics of the Clock Network (CPCI-S收录)
会议
作者:
Ye, Lin[1]
;
Lu, Yudong[2]
;
Wang, Xin[2]
;
Huang, Yun[2]
;
He, Chunhua[2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
integrated circuit
failure prediction
health management
delay characteristics
Creep deformation and fracture behavior of microscale Cu/Sn-3.0Ag-0.5Cu/Cu joints under electro-thermo- mechanical coupled loads (CPCI-S收录)
会议
作者:
Li, Wang-Yun[1]
;
Cao, Shan-Shan[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
micro-scale solder joint
creep deformation
current density
electro-thermo-mechanical coupled loads
Size effect on creep deformation and fracture behavior of micro-scale Cu/Sn-3.0Ag-O.5Cu/Cu solder joints (CPCI-S收录)
会议
作者:
Li, Wang-Yun[1]
;
Cao, Shan-Shan[1]
;
Zhang, Xin-Ping[1]
收藏
  |  
浏览/下载:4/0
  |  
提交时间:2019/04/11
micro-scale solder joint
size effect
creep deformation
creep mechanism
fracture behavior
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录)
会议
Wuhan, China,
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:2/0
  |  
提交时间:2019/04/11
Ball grid arrays
Electronics packaging
Flip chip devices
Isotherms
Lead
free solders
Microstructural evolution
Microstructure
Size determination
Soldered joints
Soldering
Soldering alloys
Surface chemistry
Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录)
会议
作者:
Huang, Jia-Qiang[1,2]
;
Zhou, Min-Bo[1]
;
Li, Wang-Yun[1,2]
;
Zhang, Xin-Ping[1,2]
收藏
  |  
浏览/下载:10/0
  |  
提交时间:2019/04/11
BGA solder joint
size effect
lead-free solder
interfacial reaction
microstructure
Ultrasonic measurement of particle concentration in polystyrene/glass beads composites by a differential scheme (EI收录)
会议
Indianapolis, IN, United states,
作者:
Jin, Gang[1]
;
Zou, Wei-Jian[1]
;
Xie, Yun[1]
;
Chen, Ru-Huang[1]
;
Hu, Xin[1]
收藏
  |  
浏览/下载:1/0
  |  
提交时间:2019/04/11
Elastomers
Hyper equality algebras (EI收录)
会议
Hangzhou, China,
作者:
Cheng, Xiao-Yun[1,2]
;
Xin, Xiao-Long[1]
;
Jun, Young-Bae[3]
收藏
  |  
浏览/下载:3/0
  |  
提交时间:2019/04/11
Computation theory
Computer circuits
Reconfigurable hardware
Soft computing
Observer-based consensus control for discrete-time linear multi-agent systems (EI收录)
会议
Chengdu, China,
作者:
Xin, Youming[1,2]
;
Cheng, Zunshui[1,3]
;
Shang, Yun[1]
;
Duan, Deyu[1]
收藏
  |  
浏览/下载:0/0
  |  
提交时间:2019/04/11
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