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浏览/检索结果: 共7条，第1-7条 帮助 限定条件 发表日期：2012     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K 期刊论文 colloids and surfaces a physicochemical and engineering aspects, 2012 Zang, Likun; Yuan, Zhangfu; Zhu, Yuanqing; Xu, Bingsheng; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/12 Surfaces and interfaces  Intermetallics  Metals and alloys  Scanning electron microscopy (SEM)  Microstructure  LEAD-FREE SOLDERS  SN-AG-CU  SURFACE-TENSION  MOLTEN SILICON  WETTABILITY  SUBSTRATE  ALLOYS  DYNAMICS  SYSTEMS  AL   Spreading kinetics of a Sn-30Bi-0.5Cu alloy on a Cu substrate 期刊论文 科学通报 英文版, 2012 Zang LiKun; Yuan ZhangFu; Zhan YaPeng; Wang ChenYu; Xu BingSheng 收藏  |  浏览/下载：4/0  |  提交时间：2015/11/12 molten metal and alloys  Pb-free solder  sessile drop method  kinetics  electronic materials  SURFACE-TENSION  WETTABILITY  INTERFACE  DYNAMICS  SYSTEMS  AL   Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu Alloys on Copper Substrates 期刊论文 materials transactions, 2012 Zhang, Xiaorui; Matsuura, Hiroyuki; Tsukihashi, Fumitaka; Yuan, Zhangfu 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/16 wettability  tin-based alloys  sessile drop method  LEAD-FREE SOLDERS  WETTING BEHAVIOR  TEMPERATURE  REACTIVITY  NI   Wettability and interfacial characteristic of Sn-Ag-Cu solder on Ni substrates at elevated temperatures 会议论文 Zanga, Likun; Yuan, Zhangfu; Yan, Hongliang; Li, Xinxue 收藏  |  浏览/下载：2/0  |  提交时间：2015/11/17 Wettability of Sn-Zn, Sn-Ag-Cu and Sn-Bi-Cu alloys on copper substrates 会议论文 Zhang, Xiaorui; Matsuura, Hiroyuki; Tsukihashi, Fumitaka; Yuan, Zhangfu 收藏  |  浏览/下载：4/0  |  提交时间：2017/12/03 Removal of the vanadium impurities from crude TiCl4 with high content of vanadium using a mixture of Al power and white mineral oil 期刊论文 hydrometallurgy, 2012 Xiong, Shaofeng; Yuan, Zhangfu; Yin, Zhoulan; Yan, Wenbin 收藏  |  浏览/下载：1/0  |  提交时间：2015/11/10 Vanadium oxytrichloride  Purification  Mixture process  Mineral oil  Aluminum  OPTIMIZATION   Reactive Wetting Processes and Triple-Line Configuration of Sn-3.5Ag on Cu Substrates at Elevated Temperatures 期刊论文 journal of electronic materials, 2012 Zang, Likun; Yuan, Zhangfu; Cao, Zhanmin; Matsuura, Hiroyuki; Tsukihashi, Fumitaka 收藏  |  浏览/下载：3/0  |  提交时间：2015/11/12 Wetting  metals and alloys  melting  interface  electronic materials  LEAD-FREE SOLDERS  BI-SN SYSTEM  SURFACE-TENSION  ALLOYS  AG  EQUILIBRIUM  BEHAVIOR