Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at   temperatures ranging from 523 K to 673 K

doi:10.1016/j.colsurfa.2012.08.052

CORC > 北京大学 > 工学院

	Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K
	Zang, Likun ; Yuan, Zhangfu ; Zhu, Yuanqing ; Xu, Bingsheng ; Matsuura, Hiroyuki ; Tsukihashi, Fumitaka
刊名	colloids and surfaces a physicochemical and engineering aspects
	2012
关键词	Surfaces and interfaces Intermetallics Metals and alloys Scanning electron microscopy (SEM) Microstructure LEAD-FREE SOLDERS SN-AG-CU SURFACE-TENSION MOLTEN SILICON WETTABILITY SUBSTRATE ALLOYS DYNAMICS SYSTEMS AL
DOI	10.1016/j.colsurfa.2012.08.052
英文摘要	Spreading behaviors in the reactive Sn-Bi-Cu/Ni system were investigated by the sessile drop method at temperatures ranging from 523 K to 673 K. Contact angles and the triple line frontier, characterized by the drop base radius R, were recorded dynamically with a high resolution CCD in an Ar-H-2 flow. Equilibrium contact angles between Sn-17Bi-0.5Cu solder and Ni substrate decrease monotonously with the temperature increasing, which are 43.51, 25.80, 24.51 and 20.00 at 523K, 573K, 623 K and 673 K. respectively. Triple line mobility is obtained when calculating the derivative of R. The maximal triple line velocity approximately increases with the temperature by comparison of the four different spreading processes. Double layer intermetallics formed at the Sn-17Bi-0.5Cu/Ni interface are identified by EPMA and EDS analysis, which are (Cu,Ni)(6)Sn-5 adjacent to the solder and Ni3Sn4 adjacent to the Ni substrate, respectively. The intermetallic compounds could effectively enhance the triple line mobility because of reaction product formation at the diffusion frontier. (C) 2012 Elsevier B.V. All rights reserved.; Chemistry, Physical; SCI(E); EI; 0; ARTICLE; 57-65; 414
语种	英语
内容类型	期刊论文
源URL	[http://ir.pku.edu.cn/handle/20.500.11897/229132]
专题	工学院
推荐引用方式 GB/T 7714	Zang, Likun,Yuan, Zhangfu,Zhu, Yuanqing,et al. Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K[J]. colloids and surfaces a physicochemical and engineering aspects,2012.
APA	Zang, Likun,Yuan, Zhangfu,Zhu, Yuanqing,Xu, Bingsheng,Matsuura, Hiroyuki,&Tsukihashi, Fumitaka.(2012).Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K.colloids and surfaces a physicochemical and engineering aspects.
MLA	Zang, Likun,et al."Spreading process and interfacial characteristic of Sn-17Bi-0.5Cu/Ni at temperatures ranging from 523 K to 673 K".colloids and surfaces a physicochemical and engineering aspects (2012).