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浏览/检索结果: 共21条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择作者升序作者降序题名升序题名降序发表日期升序发表日期降序提交时间升序提交时间降序 Research on Nozzle Deposition and Printing Parameters for 3D Cell Printer System (CPCI-S收录) 会议 作者:  Mi, Sheng-Li[1];  Xu, Yuan-Yuan[1];  Liu, Duo-Jing[1];  Liu, Chang-Yong[1];  Wu, Zheng-Jie[1] 收藏  |  浏览/下载：1/0  |  提交时间：2019/04/11 Three-dimensional printer  Cell printing  Printing parameters   Large magnetostrain in magnetic-field-aligned Mn0.965CoGe compound (CPCI-S收录) 会议 作者:  Hu, Qiu-Bo[1,2,3];  Hu, Yong[1,2];  Fang, Yong[4];  Wang, Dun-Hui[1,2];  Cao, Qing-Qi[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Enhancing distributed differential evolution with a space-driven topology (EI收录) 会议 Vancouver, BC, Canada, 作者:  Ge, Yong-Feng[1];  Yu, Wei-Jie[2];  Li, Jing-Jing[3];  Yu, Zhi-Wen[4];  Zhang, Jun[5] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 Global optimization  Optimization  Topology   Fabrication Process of a Triple-Layer Stacked TSV Interposer for Switch Matrix Consisting of Eight RF Chips (CPCI-S收录) 会议 作者:  Meng, Wei[1];  Guan, Yong[2];  Zeng, Qinghua[2];  Chen, Jing[2];  Jin, Yufeng[1,2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Bian, Yuan[1];  Zhong, Xiao[1];  Chen, Jing[1] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 3D packaging  fine pitch TSV  micro heater  thermocouple  quality evaluation   Discussion on Lean UX with Fruit Fly Optimization Algorithm in Complex Adaptive Systems Perspective 会议 作者:  Lei, Xi-ping[1];  Peng, Hua-ming[1];  Wang, Jing[1];  Xiong, Zhi-yong[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Lean UX  Complex adaptive systems  Fruit fly optimization algorithm  Simulation framework   Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening (CPCI-S收录) 会议 作者:  Guan, Yong[1];  Zeng, Qinghua[1];  Chen, Jing[1];  Ma, Shenglin[2];  Jin, Yufeng[3] 收藏  |  浏览/下载：8/0  |  提交时间：2019/04/11 TSV  3D packaging  sidewall insulation  electrical properties  CMP   Thermal-Mechanical Reliability Assessment of TSV Structure for 3D IC Integration (CPCI-S收录) 会议 作者:  Liu, Huan[1];  Zeng, Qinghua[1];  Guan, Yong[1];  Fang, Runiu[1];  Sun, Xin[1] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Fabrication Process of a TSV Interposer for Radio Frequency Chip with Integrated Passive Devices (CPCI-S收录) 会议 作者:  Meng, Wei[1];  Jin, Yufeng[1];  Guan, Yong[2];  Zeng, Qinghua[2];  Hen, Jing C.[2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 TSV Interposer  Lift-off Process  Interated Passive Devices  Radio Frequency System   Tourism Supply Chain Coordination with Price Discount and Quantity Flexibility Contracts (CPCI-S收录) 会议 作者:  Shi, Yuan[1];  Ji, Jing-na[1];  Zhang, Zhi-yong[1];  Yang, Lei[1] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Price discount  Quantity flexibility contract  Supply chain coordination  Tourism supply chain