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浏览/检索结果: 共12条，第1-10条 帮助 限定条件 内容类型：会议     已选(0)清除 条数/页：5101520253035404550556065707580859095100   排序方式：请选择发表日期升序发表日期降序提交时间升序提交时间降序题名升序题名降序作者升序作者降序 Analysis of baseflow index based hydrological model in Upper Wei River basin on the Loess Plateau in China (EI收录) 会议 Guangzhou, China, 作者:  Liu, Dengfeng[1];  Chang, Jianxia[1];  Tian, Fuqiang[2];  Huang, Qiang[1];  Meng, Xianmeng[3] 收藏  |  浏览/下载：7/0  |  提交时间：2019/04/11 Arid regions  Climate models  Drought  Groundwater  Hydrology  Landforms  Remote sensing  Rivers  Runoff  Sediments  Soil moisture  Stream flow  Watersheds   A low-dropout regulator with power supply rejection improvement by bandwidth-zero tracking (EI收录) 会议 Ishigaki Island, Okinawa, Japan, 作者:  Lu, Yan[1,2,3];  Yao, Ruo He[1];  Huang, Da Qiang[1];  Su, Julien[1];  Jiang, Junmin[2] 收藏  |  浏览/下载：6/0  |  提交时间：2019/04/11 CMOS integrated circuits  Voltage regulators   Interfacial reactions and formation of inter metallic compound of Sn-ball/Sn-3.0Ag-0.5Cu-paste/Cu joints in flip-chip on BGA packaging (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1];  Zhou, Min-Bo[1];  Li, Wang-Yun[1];  Zhang, Xin-Ping[1] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 lead-free solder joint  interfacial reaction  microstructure  BGA  differential scanning calorimetry   Reverse Query-Aware Locality-Sensitive Hashing for High-Dimensional Furthest Neighbor Search (CPCI-S收录) 会议 作者:  Huang, Qiang[1];  Feng, Jianlin[1];  Fang, Qiong[2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Comparison of two typhoon-induced storm surges at the Zhanjiang Coast (EI收录) 会议 Kuta, Bali, Indonesia, 作者:  Zhao, Xue[1];  Xie, Qiang[2];  Hong, Bo[3];  Xu, Hongzhou[2];  Chen, Lingfang[2] 收藏  |  浏览/下载：3/0  |  提交时间：2019/04/11 Atmospheric pressure  Earth sciences  Floods  Geology  Storms   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：5/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Intermetallics  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Packaging materials  Soldered joints  Soldering  Soldering alloys  Surface chemistry  Thermal expansion   Reverse query-Aware locality-sensitive hashing for high-dimensional furthest neighbor search (EI收录) 会议 San Diego, CA, United states, 作者:  Huang, Qiang[1];  Feng, Jianlin[1];  Fang, Qiong[2] 收藏  |  浏览/下载：0/0  |  提交时间：2019/04/11 Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (EI收录) 会议 Wuhan, China, 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：2/0  |  提交时间：2019/04/11 Ball grid arrays  Electronics packaging  Flip chip devices  Isotherms  Lead  free solders  Microstructural evolution  Microstructure  Size determination  Soldered joints  Soldering  Soldering alloys  Surface chemistry   Size effect on the interfacial reactions and microstructural evolution of Cu/Sn3.0Ag0.5Cu-ball/Sn3.0Ag0.5Cu-paste/Cu joints in flip-chip on B (CPCI-S收录) 会议 作者:  Huang, Jia-Qiang[1,2];  Zhou, Min-Bo[1];  Li, Wang-Yun[1,2];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：10/0  |  提交时间：2019/04/11 BGA solder joint  size effect  lead-free solder  interfacial reaction  microstructure   Interfacial reactions and microstructural evolution of BGA structure Cu/Sn3.0Ag0.5Cu/Sn58Bi/Cu mixed assembly joints during isothermal aging (CPCI-S收录) 会议 作者:  Huang, Lia-Qiang[1,2];  Zhou, Min-Bo[1];  Zhang, Xin-Ping[1,2] 收藏  |  浏览/下载：4/0  |  提交时间：2019/04/11 Sn58Bi  Sn3.0Ag0.5Cu  Mixed solder joint  Microstructure  interfacial reaction  Ball grid array