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Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials 期刊论文
MICROGRAVITY SCIENCE AND TECHNOLOGY, 2023, 卷号: 35, 期号: 6, 页码: 11
作者:  Wang, Shuai;  Ma, Xiang;  Gao, Quan;  Wang, Jinyu;  Xu, Na
收藏  |  浏览/下载:5/0  |  提交时间:2023/12/11
Molecular dynamics simulation on the dissolution and diffusion characteristics of FeCrAl alloy in liquid LBE 期刊论文
ANNALS OF NUCLEAR ENERGY, 2023, 卷号: 192, 页码: 109983
作者:  Xie, Lu;  DaWu, Guang;  Peng Q(彭庆);  Wang, WenRui
收藏  |  浏览/下载:7/0  |  提交时间:2023/09/05
Simulation study on single-event burnout in field-plated Ga2O3 MOSFETs 期刊论文
MICROELECTRONICS RELIABILITY, 2023, 卷号: 149
作者:  Yu, Cheng-hao;  Guo, Hao-min;  Liu, Yan;  Wu, Xiao-dong;  Zhang, Li-long
收藏  |  浏览/下载:11/0  |  提交时间:2023/11/10
A full range of defect passivation strategy targeting efficient and stable planar perovskite solar cells 期刊论文
Chemical Engineering Journal, 2023, 卷号: 451, 页码: 10
作者:  Y. S. Sun;  S. Yang;  Z. Y. Pang;  H. P. Jiang;  S. H. Chi
收藏  |  浏览/下载:11/0  |  提交时间:2023/06/14


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