Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials

doi:10.1007/s12217-023-10082-9

	Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials
	Wang, Shuai; Ma, Xiang; Gao, Quan; Wang, Jinyu; Xu, Na; Zhang, Yonghai; Wei, Jinjia; Zhao JF(赵建福); Li, Bin
刊名	MICROGRAVITY SCIENCE AND TECHNOLOGY
	2023-11-17
卷号	35 期号:6 页码:11
关键词	Thermal interface material Thermal conductivity Copper powder Diamond particles Filling rate
ISSN号	0938-0108
DOI	10.1007/s12217-023-10082-9
通讯作者	Ma, Xiang(maxiang7632@126.com) ; Xu, Na(naxu_xjtu@163.com)
英文摘要	An experimental investigation was conducted to prepare and study the thermal conductivity performance of copper and diamond composite materials. Copper powder and diamond particles were used as fillers, epoxy resin was used as matrix, and composite materials were prepared by vacuum-assisted mechanical stirring. The thermal expansion coefficient of different composite materials was measured by a laser flash method, which can be used to calculate the thermal conductivity. The effect of the filling rate of copper powder, the morphology of copper powder, the filling rate of diamond, and the thermal conductivity of the particles on the thermal conductivity of composite materials was studied. The results showed that thermal conductivity of copper powder and diamond particles composite materials were 874% and 535% higher than that of the epoxy resin when their filling rates were 50.3 vol.% and 40.0 vol.%, respectively. For two-dimensional flake copper powder materials, the thermal conductivity could be effectively improved at a lower filling rate. However, the flake particles were easy to aggregate at a high filling rate, which maybe cause the composite materials to pulverize.
分类号	二类
资助项目	National Natural Science Foundation of China[51976163] ; Open Project of the State Key Laboratory of Superabrasives[GXNGJSKL-2022-02] ; Fundamental Research Funds for the Central Universities[XTR052022011] ; Joint Funds of the National Natural Science Foundation of China[U2141218] ; Young Talent Support Plan of Xi'an Jiaotong University
WOS关键词	INTERFACE MATERIALS ; EPOXY
WOS研究方向	Engineering ; Thermodynamics ; Mechanics
语种	英语
WOS记录号	WOS:001102521700001
资助机构	National Natural Science Foundation of China ; Open Project of the State Key Laboratory of Superabrasives ; Fundamental Research Funds for the Central Universities ; Joint Funds of the National Natural Science Foundation of China ; Young Talent Support Plan of Xi'an Jiaotong University
其他责任者	Ma, Xiang ; Xu, Na
内容类型	期刊论文
源URL	[http://dspace.imech.ac.cn/handle/311007/93361]
专题	力学研究所_国家微重力实验室
推荐引用方式 GB/T 7714	Wang, Shuai,Ma, Xiang,Gao, Quan,et al. Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials[J]. MICROGRAVITY SCIENCE AND TECHNOLOGY,2023,35(6):11.
APA	Wang, Shuai.,Ma, Xiang.,Gao, Quan.,Wang, Jinyu.,Xu, Na.,...&Li, Bin.(2023).Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials.MICROGRAVITY SCIENCE AND TECHNOLOGY,35(6),11.
MLA	Wang, Shuai,et al."Preparation and Performance Characterization of Copper and Diamond Filled Composite Thermal Conductivity Materials".MICROGRAVITY SCIENCE AND TECHNOLOGY 35.6(2023):11.