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CORC

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Insights into protective performance of CoCrNi medium entropy alloy coating subjected to supersonic micro-ballistic impact 期刊论文
INTERNATIONAL JOURNAL OF IMPACT ENGINEERING, 2023, 卷号: 180, 页码: 104714
作者:  Dong, JL;  Li, FC;  Wu XQ(吴先前);  Wang, GJ;  Zhang, XP
收藏  |  浏览/下载：9/0  |  提交时间：2023/09/05
Catalytic ignition of CO over CuCeZr based catalysts: New insights into the support effects and reaction pathways 期刊论文
APPLIED CATALYSIS B-ENVIRONMENTAL, 2023, 卷号: 327, 页码: 122435
作者:  Kang RN(康润宁);  Zhang ZR(张梓睿);  Bin F(宾峰);  Wei XL(魏小林);  Li, Yongdan
收藏  |  浏览/下载：7/0  |  提交时间：2023/07/17
Facile galvanic replacement deposition of nickel on copper substrate in deep eutectic solvent and its activation ability for electroless Ni–P plating 期刊论文
Journal of Solid State Electrochemistry, 2022, 卷号: 26, 期号: 5, 页码: 1313-1322
作者:  Hu, Guanqun;  Huang, Rui;  Wang, Hongli;  Zhao, Qiuping;  Zhang, Xingkai
收藏  |  浏览/下载：34/0  |  提交时间：2022/06/20
Spreading behavior of Sn droplets impacting Cu and stainless steel substrates 期刊论文
SURFACES AND INTERFACES, 2022, 卷号: 29
作者:  Wang, Xiwushan;  Yu, Weiyuan;  Wang, Mingkang;  Wang, Fengfeng;  Wu, Baolei
收藏  |  浏览/下载：13/0  |  提交时间：2022/04/21
Boosted photoinduced cathodic protection performance of ZnIn2S4/TiO2 nanoflowerbush with efficient photoelectric conversion in NaCl solution 期刊论文
JOURNAL OF ALLOYS AND COMPOUNDS, 2021, 卷号: 876, 页码: 15
作者:  Jiang, Xuhong;  Sun, Mengmeng;  Chen, Zhuoyuan;  Jing, Jiangping;  Lu, Guiying
收藏  |  浏览/下载：42/0  |  提交时间：2021/12/07
Effect of interfacial microstructure evolution on the peeling strength and fracture of AMB Cu-metalized AlN substrate 期刊论文
JOURNAL OF THE AMERICAN CERAMIC SOCIETY, 2021, 页码: 13
作者:  Zhang, Yukun;  Zhang, Jinsong;  Chen, Jichun
收藏  |  浏览/下载：50/0  |  提交时间：2021/11/22
An oxidation-nitridation-denitridation approach to transform metal solids into foams with adjustable pore sizes for energy applications 期刊论文
SCIENCE BULLETIN, 2021, 卷号: 66, 期号: 15, 页码: 1525-1532
作者:  Qin, Hao;  Zhen, Chao;  Jia, Chunxu;  Yang, Zhiqing;  Ye, Hengqiang
收藏  |  浏览/下载：31/0  |  提交时间：2021/10/15
Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration 期刊论文
Journal of Materials Science: Materials in Electronics, 2021, 卷号: 32, 期号: 13, 页码: 17336-17348
作者:  Qiu, Hongyu;  Xu, Han;  Zhang, Chuge;  Hu, Xiaowu;  Jiang, Xiongxin
收藏  |  浏览/下载：11/0  |  提交时间：2022/02/17
Electrochemical and thermal synthesis of Nb3Sn coatings on Nb substrates 期刊论文
MATERIALS LETTERS, 2021, 卷号: 292, 页码: 4
作者:  Lu, Ming;  Pan, Feng;  Guo, Hao;  Huang, Shichun;  Yang, Ziqin
收藏  |  浏览/下载：44/0  |  提交时间：2021/12/10
Wettability of GH4099 and MHC alloys by AgCuTi, TiZrCuTi and NiCrSiB filler metals and evaluation of diffusion-brazability 期刊论文
Journal of Manufacturing Processes, 2021, 卷号: 64, 页码: 1089-1097
作者:  Che, Hongyan;  Zheng, Tianming;  Wang, Tiejun;  Li, Wei;  Lin, Qiaoli
收藏  |  浏览/下载：16/0  |  提交时间：2021/04/12

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