Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration

doi:10.1007/s10854-021-06256-z

	Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration
	Qiu, Hongyu 1; Xu, Han 1; Zhang, Chuge 1; Hu, Xiaowu 1; Jiang, Xiongxin 1; Li, Qinglin 2
刊名	Journal of Materials Science: Materials in Electronics
	2021-07-01
卷号	32 期号:13 页码:17336-17348
关键词	Binary alloys Copper alloys Electromigration Tensile strength Tin alloys Bonding joints Co content Coaddition Current direction Electric density Micro-structure evolutions Solder joints
ISSN号	09574522
DOI	10.1007/s10854-021-06256-z
英文摘要	The influence of solid–liquid electromigration on Cu-xCo/Sn-3.0Ag-0.5Cu/Cu-xCo (x = 0, 30 and 50 wt.%) joints bonded at 260 °C with electric density of 2.89 × 102 A/cm2 for 10 h was investigated. The experiment revealed that the (Cu,Co)6Sn5 intermetallic compound (IMC) was dominant phase in bonding joints with the addition of Co. Besides, the lamellate (Co,Cu)Sn2 grains nucleated around the Co-rich phases. Additionally, the current direction was at an angle to the orientation of prismatic (Cu,Co)6Sn5 grain [100] direction compared to that of the Cu6Sn5 [100] direction aligned with the electric current direction. The analysis results of nanoindentation show that the hardness and the Young’s modulus increased with the Co content in the substrates. Moreover, the additional Co caused the refinement of IMCs grain and the improvement of tensile strength of solder joints. © 2021, The Author(s), under exclusive licence to Springer Science+Business Media, LLC, part of Springer Nature.
WOS研究方向	Engineering ; Materials Science ; Physics
语种	英语
出版者	Springer
WOS记录号	WOS:000658106000002
内容类型	期刊论文
源URL	[http://ir.lut.edu.cn/handle/2XXMBERH/150900]
专题	材料科学与工程学院
作者单位	1.School of Mechanical & Electrical Engineering School, Nanchang University, Nanchang; 330031, China; 2.State Key Laboratory of Advanced Processing and Recycling of Nonferrous Metals, Lanzhou University of Technology, Lanzhou; 730050, China
推荐引用方式 GB/T 7714	Qiu, Hongyu,Xu, Han,Zhang, Chuge,et al. Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration[J]. Journal of Materials Science: Materials in Electronics,2021,32(13):17336-17348.
APA	Qiu, Hongyu,Xu, Han,Zhang, Chuge,Hu, Xiaowu,Jiang, Xiongxin,&Li, Qinglin.(2021).Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration.Journal of Materials Science: Materials in Electronics,32(13),17336-17348.
MLA	Qiu, Hongyu,et al."Influence of Co addition on microstructure evolution and mechanical strength of solder joints bonded with solid–liquid electromigration".Journal of Materials Science: Materials in Electronics 32.13(2021):17336-17348.