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浏览/检索结果: 共693条，第1-10条

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	KCl Treatment of CdS Electron-Transporting Layer for Improved Performance of Sb₂(S,Se)₃ Solar Cells 期刊论文 ACS APPLIED MATERIALS & INTERFACES, 2023, 卷号: 15 作者: Liu, Aoxing; Tang, Rongfeng; Huang, Lei; Xiao, Peng; Dong, Yizhe 收藏 \| 浏览/下载：7/0 \| 提交时间：2023/11/17 Sb-2(S,Se)(3) antimony selenosulfide KCl interface engineering solar cell
	Band engineering of valleytronics WSe₂-MoS₂ heterostructures via stacking form, magnetic moment and thickness 期刊论文 CHINESE PHYSICS B, 2023, 卷号: 32 作者: Wu, Yanwei; Zhang, Zongyuan; Ma, Liang; Liu, Tao; Hao, Ning 收藏 \| 浏览/下载：5/0 \| 提交时间：2023/11/10 valleytronics thickness stacking magnetic moment
	Anisotropic mechanical response of a 2D covalently bound fullerene lattice 期刊论文 CARBON, 2023, 卷号: 202, 页码: 118-124 作者: Zhao, Shuai; Zhang, Xibei; Ni, Yong; Peng, Qing; Wei, Yujie 收藏 \| 浏览/下载：88/0 \| 提交时间：2023/01/25 MonolayerC(60) fullerene(mC(60)) Mechanical properties Anisotropic strength Strain engineering Band gap
	Formation Mechanism of Precursor Films at High Temperatures: A Review 期刊论文 Chinese Journal of Mechanical Engineering (English Edition), 2022, 卷号: 35, 期号: 1 作者: Lin, Qiaoli; Liu, Lu; Zhu, Wenqi 收藏 \| 浏览/下载：27/0 \| 提交时间：2022/04/21 Contact angle Oxide films Temperature Diffusing band Film formations Formation mechanism Halo Highest temperature Interfacial structures Precursor films Recent researches Research focus Wetting foot
	Synergistic defect engineering for improving n-type NbFeSb thermoelectric performance through high-throughput computations 期刊论文 JOURNAL OF MATERIALS CHEMISTRY A, 2022, 卷号: 10 作者: Li, Jingyu; Zhu, Jianbo; Ti, Zhuoyang; Zhai, Wenya; Wei, Liuming 收藏 \| 浏览/下载：14/0 \| 提交时间：2022/12/23
	Medium-entropy (Me,Ti)(0.1)(Zr,Hf,Ce)(0.9)O-2 (Me = Y and Ta): Promising thermal barrier materials for high-temperature thermal radiation shielding and CMAS blocking 期刊论文 JOURNAL OF MATERIALS SCIENCE & TECHNOLOGY, 2022, 卷号: 123, 页码: 144-153 作者: Qiu, Shuaihang; Xiang, Huimin; Dai, Fu-Zhi; Wang, Hailong; Huang, Muzhang 收藏 \| 浏览/下载：101/0 \| 提交时间：2022/07/01 Medium-entropy ceramics Thermal barrier coatings Thermal radiation shielding CMAS resistance Infrared absorbance
	The controllable electronic characteristics and Schottky barrier of graphene/GaP heterostructure via interlayer coupling and in-plane strain 期刊论文 Materials Science and Engineering B: Solid-State Materials for Advanced Technology, 2022, 卷号: 284 作者: Lu, Xuefeng; Li, Lingxia; Guo, Xin; Ren, Junqiang; Xue, Hongtao 收藏 \| 浏览/下载：15/0 \| 提交时间：2022/08/09 Binding energy Calculations Gallium compounds Graphene Ground state Heterojunctions III-V semiconductors Ohmic contacts Schottky barrier diodes Strain Thermoelectric equipment Van der Waals forces Electronic characteristics Graphene/GaP In-plane strains Interlayer coupling Layer-spacing Micro/nano Nanoelectronic devices P-type Schottky barriers Schottky contacts
	Performance of ferroelectric visible light type II Ag10Si4O13/TiO2 heterojunction photocatalyst 期刊论文 Catalysis Today, 2022, 卷号: 400-401, 页码: 146-158 作者: Li, Cuixia; Sun, Huizhen; Jin, Haize; Li, Wenshen; Liu, Jingbo Louise 收藏 \| 浏览/下载：21/0 \| 提交时间：2022/07/20 Charge transfer Electronic properties Energy gap Ferroelectricity Heterojunctions Light Photocatalytic activity Polarization Semiconductor materials Silicon Silicon compounds Spectroscopic analysis Titanium dioxide Water pollution Water resources Ag10si4O13/TiO2 heterojunction Decolourization Efficient decomposition Methylene Blue Performance Semiconductor photocatalyst TiO 2 Type II Visible light Water remediation
	Band-pass filtering analysis on low-frequency tonal noise generated from a Krueger storage cavity 期刊论文 AEROSPACE SCIENCE AND TECHNOLOGY, 2022, 卷号: 128, 页码: 9 作者: Lu WS(陆维爽); Liu, Peiqing; Guo, Hao 收藏 \| 浏览/下载：7/0 \| 提交时间：2022/12/20 Krueger flap Storage cavity Aero-acoustic Noise characteristics Band-pass filtering
	Study of microstructure and mechanical properties of Cu/In-45Cu/SiC joints connected by ultrasonic-assisted TLP 期刊论文 Microelectronics Reliability, 2022, 卷号: 135 作者: Yu, Weiyuan; Li, Binbin; Wu, Baolei; Wang, Fengfeng; Wang, Mingkang 收藏 \| 浏览/下载：15/0 \| 提交时间：2022/08/09 Binary alloys Copper Copper alloys Indium alloys Lead-free solders Microstructure Shear flow Silicon carbide Soldering Temperature Thermoelectric equipment Wide band gap semiconductors Composite solders Electronics devices In-45cu composite solder paste Intermetallics compounds Microstructures and mechanical properties Service temperature Shears strength Solderpaste Ultrasonic action time Ultrasonic-assisted TLP

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