CORC

在结果中检索

CORC

浏览/检索结果: 共22条，第1-10条 帮助

已选(0)清除 条数/页：   排序方式：
Growth Behavior of Cu6Sn5 Grains at Sn/(001)Cu Interface by Imposing Temperature Gradient 会议论文
2018 19TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2018-01-01
作者:  Zhao, Ning;  Chen, Shi;  Liu, Chunying;  Zhong, Yi;  Ma, Haitao
收藏  |  浏览/下载：4/0  |  提交时间：2019/12/02
Research on the packaging design based on flash and paper vision 3D technology 期刊论文
Journal of Advanced Oxidation Technologies, 2018, 卷号: 21, 期号: 2
作者:  Zhang, S.*
收藏  |  浏览/下载：5/0  |  提交时间：2019/12/24
Fabrication of embedded piezoelectric sensors and its application in traffic engineering 会议论文
Singapore, Singapore, September 1, 2017 - September 3, 2017
作者:  Zhang, Xingjun;  Song, Shanglin;  Yao, Ming Jie
收藏  |  浏览/下载：1/0  |  提交时间：2020/11/15
DEVELOPMENT OF WAFER LEVEL HYBRID BONDING PROCESS USING PHOTOSENSITIVE ADHESIVE AND CU PILLAR BUMP 会议论文
China Semiconductor Technology International Conference (CSTIC), Shanghai, PEOPLES R CHINA, 2017-03-12
作者:  Yao, Mingjun;  Yu, Daquan;  Zhao, Ning;  Fan, Jun;  Xiao, Zhiyi
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/02
Fabrication, Characterization, and Simulation of a Low-Cost TSV Integration Without Front-Side CMP Process 期刊论文
IEEE TRANSACTIONS ON SEMICONDUCTOR MANUFACTURING, 2016
Guan, Yong; Zhu, Yunhui; Ma, Shenglin; Zeng, Qinghua; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：2/0  |  提交时间：2017/12/03
Fabrication and Traceable Quality Evaluation of Fine Pitch TSV with Self-integrated Micro Heater and Thermocouple 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Bian, Yuan; Zhong, Xiao; Chen, Jing; Ma, Shenglin; Zhu, Yunhui; Jin, Yufeng
收藏  |  浏览/下载：7/0  |  提交时间：2017/12/03
Fabrication and Characterization of Fine Pitch TSV Integration with Self-aligned Backside Insulation Layer Opening 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Parametric Study of DRIE Process for Enhancing the Profile-preserving Property of Square Through Silicon Via 其他
2016-01-01
Guan, Yong; Zeng, Qinghua; Chen, Jing; Ma, Shenglin; Meng, Wei; Jin, Yufeng
收藏  |  浏览/下载：3/0  |  提交时间：2017/12/03
Thermal-Mechanical Reliability Analysis of Connection Structure between Redistribution Layer and TSV for MEMS Packaging 其他
2016-01-01
Meng, Wei; Zeng, Qinghua; Guan, Yong; Chen, Jing; Jin, Yufeng
收藏  |  浏览/下载：5/0  |  提交时间：2017/12/03
Dissolution and precipitation kinetics of Cu6Sn5 intermetallics in Cu/Sn/Cu micro interconnects under temperature gradient 期刊论文
INTERMETALLICS, 2016, 卷号: 79, 页码: 28-34
作者:  Zhao, N.;  Zhong, Y.;  Huang, M. L.;  Ma, H. T.;  Dong, W.
收藏  |  浏览/下载：2/0  |  提交时间：2019/12/09

©版权所有 ©2017 CSpace - Powered by CSpace